Construction method of electronic chip plant waffle slab structure
The invention discloses a construction method of an electronic chip plant waffle slab structure, particularly relates to a construction method of the electronic chip plant waffle slab structure, and belongs to the field of electronic chip plant building. The construction method comprises the followi...
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| creator | JIN FUXING LI WENBO LI GUO LUO LI HUANG HUANHUAN TIAN MINGBING ZHOU MIN WU DEGEN NIU LIANG ZHOU YU LI XIE JI YANG |
| description | The invention discloses a construction method of an electronic chip plant waffle slab structure, particularly relates to a construction method of the electronic chip plant waffle slab structure, and belongs to the field of electronic chip plant building. The construction method comprises the following steps that A, a waffle slab formwork supporting system is erected; B, a bottom formwork is laid;C, a cheese tube is positioned on the bottom formwork, and a base plate and a base of the cheese tube are mounted on the bottom formwork; D, waffle slab steel bar binding is conducted; E, a tube bodyand accessories of the cheese tube are mounted on the base; F, concrete pouring is conducted; G, concrete surface leveling curing is conducted; H, the supporting system is dismantled; J, the base andthe base plate of the cheese tube are dismantled; K, a top cover of the cheese tube is dismantled; and L, pollutants left on the cheese tube are cleared away. According to the construction method of the electronic chip plant wa |
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The construction method comprises the following steps that A, a waffle slab formwork supporting system is erected; B, a bottom formwork is laid;C, a cheese tube is positioned on the bottom formwork, and a base plate and a base of the cheese tube are mounted on the bottom formwork; D, waffle slab steel bar binding is conducted; E, a tube bodyand accessories of the cheese tube are mounted on the base; F, concrete pouring is conducted; G, concrete surface leveling curing is conducted; H, the supporting system is dismantled; J, the base andthe base plate of the cheese tube are dismantled; K, a top cover of the cheese tube is dismantled; and L, pollutants left on the cheese tube are cleared away. 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| language | chi ; eng |
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| subjects | BUILDING CEILINGS FIXED CONSTRUCTIONS FLOORS GENERAL BUILDING CONSTRUCTIONS INSULATION OR OTHER PROTECTION OF BUILDINGS ROOFS WALLS, e.g. PARTITIONS |
| title | Construction method of electronic chip plant waffle slab structure |
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