Water-cooled heat sink for modular series connection type high-voltage frequency converter
The invention discloses a water-cooled heat sink for a modular series connection type high-voltage frequency converter water-cooled heat sink. The water-cooled heat sink for the modular series connection type high-voltage frequency converter comprises a modular series connection type high-voltage fr...
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| creator | ZHANG PENG SUN NAIHUI |
| description | The invention discloses a water-cooled heat sink for a modular series connection type high-voltage frequency converter water-cooled heat sink. The water-cooled heat sink for the modular series connection type high-voltage frequency converter comprises a modular series connection type high-voltage frequency converter body, wherein a low-voltage power module series partial voltage topological structure is adopted in a main circuit of the modular series connection type high-voltage frequency converter body, a water-cooled heat sink is arranged in the modular series connection type high-voltage frequency converter body, the water-cooled heat sink is mainly composed of multiple independent heat dissipation substrates and a water-cooling plate embedded with a waterway channel, the water-coolingplate is made from a novel insulating heat conductive material, a water inlet, a water outlet and a mounting hole are formed in the back of the water-cooling plate, and the water-cooling plate is fastened and connected with a |
| format | Patent |
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The water-cooled heat sink for the modular series connection type high-voltage frequency converter comprises a modular series connection type high-voltage frequency converter body, wherein a low-voltage power module series partial voltage topological structure is adopted in a main circuit of the modular series connection type high-voltage frequency converter body, a water-cooled heat sink is arranged in the modular series connection type high-voltage frequency converter body, the water-cooled heat sink is mainly composed of multiple independent heat dissipation substrates and a water-cooling plate embedded with a waterway channel, the water-coolingplate is made from a novel insulating heat conductive material, a water inlet, a water outlet and a mounting hole are formed in the back of the water-cooling plate, and the water-cooling plate is fastened and connected with a</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180904&DB=EPODOC&CC=CN&NR=108495535A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180904&DB=EPODOC&CC=CN&NR=108495535A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ZHANG PENG</creatorcontrib><creatorcontrib>SUN NAIHUI</creatorcontrib><title>Water-cooled heat sink for modular series connection type high-voltage frequency converter</title><description>The invention discloses a water-cooled heat sink for a modular series connection type high-voltage frequency converter water-cooled heat sink. The water-cooled heat sink for the modular series connection type high-voltage frequency converter comprises a modular series connection type high-voltage frequency converter body, wherein a low-voltage power module series partial voltage topological structure is adopted in a main circuit of the modular series connection type high-voltage frequency converter body, a water-cooled heat sink is arranged in the modular series connection type high-voltage frequency converter body, the water-cooled heat sink is mainly composed of multiple independent heat dissipation substrates and a water-cooling plate embedded with a waterway channel, the water-coolingplate is made from a novel insulating heat conductive material, a water inlet, a water outlet and a mounting hole are formed in the back of the water-cooling plate, and the water-cooling plate is fastened and connected with a</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNzLEKwjAURuEuDqK-w_UBCkot2FGK4uQkCC4lpH-aYMytN2mhb6-CD-B0lo8zz-43lSC5ZvZoyUIlii48yLDQk9vBK6EIcYikOQTo5DhQmnqQdZ3NR_ZJdSAjeA0IevqyEfKZLrOZUT5i9esiW5-O1_qco-cGsVcaAampL9vNfleVZVEein_MG14_O68</recordid><startdate>20180904</startdate><enddate>20180904</enddate><creator>ZHANG PENG</creator><creator>SUN NAIHUI</creator><scope>EVB</scope></search><sort><creationdate>20180904</creationdate><title>Water-cooled heat sink for modular series connection type high-voltage frequency converter</title><author>ZHANG PENG ; SUN NAIHUI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN108495535A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2018</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>ZHANG PENG</creatorcontrib><creatorcontrib>SUN NAIHUI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ZHANG PENG</au><au>SUN NAIHUI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Water-cooled heat sink for modular series connection type high-voltage frequency converter</title><date>2018-09-04</date><risdate>2018</risdate><abstract>The invention discloses a water-cooled heat sink for a modular series connection type high-voltage frequency converter water-cooled heat sink. 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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | Water-cooled heat sink for modular series connection type high-voltage frequency converter |
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