Embedded capacity substrate and processing method

The invention relates to an embedded capacity substrate and a processing method. The embedded capacity substrate comprises a first electrode layer, a second electrode layer and soft materials, whereinthe soft materials are positioned between the first electrode layer and the second electrode layer, the second electrode layer comprises a first inner metal layer and a first outer metal layer, the first inner metal layer is adhered with a first soft material, and the first outer metal layer is combined with the first inner metal layer. 本发明涉及种埋容基板及加工方法。本发明所揭示的埋层基板包含第电极层和第二电极层；以及位于所述第电极层和所述第二电极层之间的软性材料；其中所述第二电极层包含第内侧金属层和第外侧金属层，所述第内侧金属层与所述第软性材料粘结，所述第外侧金属层与所述第内侧金属层结合。