Vertical type silicon wafer magnetron sputtering film plating machine
The invention discloses a vertical type silicon wafer magnetron sputtering film plating machine. The vertical type silicon wafer magnetron sputtering film plating machine comprises a vacuum chamber, atransmission device, a vacuum-pumping system and a power supply control system, wherein the transmis...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a vertical type silicon wafer magnetron sputtering film plating machine. The vertical type silicon wafer magnetron sputtering film plating machine comprises a vacuum chamber, atransmission device, a vacuum-pumping system and a power supply control system, wherein the transmission device is arranged in the vacuum chamber and is used for hanging and moving silicon wafers, the vacuum-pumping system is used for carrying out vacuumizing, and the power supply control system is used for supplying power and controlling a working condition; the vacuum chamber comprises a washing chamber and a sputtering chamber which are hermetically connected mutually, an ion cleaning electrode is arranged in the washing chamber, and a sputtering target is arranged in the sputtering chamber; the transmission device comprises a silicon wafer hanging plate, a hanging plate base and a rail car which are arranged in the vacuum chamber, the silicon wafer hanging plate is detachably connected with the hanging plate |
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