POLISHING PAD, POLISHING METHOD USING POLISHING PAD, METHOD FOR USING SAID POLISHING PAD
Provided is a polishing pad having a resin foam article composed of a thermoplastic resin with excellent re-polishing characteristics, the polishing pad being capable of eliminating or dramatically shortening pre-polishing time and realizing simple polishing, and being capable of highly reliable and...
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| creator | YAMAMOTO SYUNJI KUBOTA TETSUJI YOKOTA NOBUTOSHI TODA SADAYUKI MASUDA MITSUO |
| description | Provided is a polishing pad having a resin foam article composed of a thermoplastic resin with excellent re-polishing characteristics, the polishing pad being capable of eliminating or dramatically shortening pre-polishing time and realizing simple polishing, and being capable of highly reliable and efficient polishing by continuous polishing at an excellent polishing speed from an initial stage.The polishing pad (1, 2) is composed of a highly rigid thermoplastic hard resin foam article having a three-dimensional cell structure partitioned by cell walls so as to have a plurality of cells andpartitions in which these cells are mutually independent. The polishing pad has a structure in which the tensile strength is 50-90 MPa, bending strength is 90-140 MPa, the tensile modulus of elasticity and the flexural elastic modulus are both 2400 MPa or greater, the average cell diameter is 4-50 micron, the average cell wall thickness is 1-5 micron, and the ratio of the average cell diameter tothe average cell wall thick |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN108349061A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN108349061A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN108349061A3</originalsourceid><addsrcrecordid>eNrjZIgI8PfxDPbw9HNXCHB00VFAcH1dQzz8XRRCg8FyqKqgcm7-QVD5YEdPF1RFPAysaYk5xam8UJqbQdHNNcTZQze1ID8-tbggMTk1L7Uk3tnP0MDC2MTSwMzQ0ZgYNQDJxDDg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>POLISHING PAD, POLISHING METHOD USING POLISHING PAD, METHOD FOR USING SAID POLISHING PAD</title><source>esp@cenet</source><creator>YAMAMOTO SYUNJI ; KUBOTA TETSUJI ; YOKOTA NOBUTOSHI ; TODA SADAYUKI ; MASUDA MITSUO</creator><creatorcontrib>YAMAMOTO SYUNJI ; KUBOTA TETSUJI ; YOKOTA NOBUTOSHI ; TODA SADAYUKI ; MASUDA MITSUO</creatorcontrib><description>Provided is a polishing pad having a resin foam article composed of a thermoplastic resin with excellent re-polishing characteristics, the polishing pad being capable of eliminating or dramatically shortening pre-polishing time and realizing simple polishing, and being capable of highly reliable and efficient polishing by continuous polishing at an excellent polishing speed from an initial stage.The polishing pad (1, 2) is composed of a highly rigid thermoplastic hard resin foam article having a three-dimensional cell structure partitioned by cell walls so as to have a plurality of cells andpartitions in which these cells are mutually independent. The polishing pad has a structure in which the tensile strength is 50-90 MPa, bending strength is 90-140 MPa, the tensile modulus of elasticity and the flexural elastic modulus are both 2400 MPa or greater, the average cell diameter is 4-50 micron, the average cell wall thickness is 1-5 micron, and the ratio of the average cell diameter tothe average cell wall thick</description><language>chi ; eng</language><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; TRANSPORTING</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180731&DB=EPODOC&CC=CN&NR=108349061A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180731&DB=EPODOC&CC=CN&NR=108349061A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YAMAMOTO SYUNJI</creatorcontrib><creatorcontrib>KUBOTA TETSUJI</creatorcontrib><creatorcontrib>YOKOTA NOBUTOSHI</creatorcontrib><creatorcontrib>TODA SADAYUKI</creatorcontrib><creatorcontrib>MASUDA MITSUO</creatorcontrib><title>POLISHING PAD, POLISHING METHOD USING POLISHING PAD, METHOD FOR USING SAID POLISHING PAD</title><description>Provided is a polishing pad having a resin foam article composed of a thermoplastic resin with excellent re-polishing characteristics, the polishing pad being capable of eliminating or dramatically shortening pre-polishing time and realizing simple polishing, and being capable of highly reliable and efficient polishing by continuous polishing at an excellent polishing speed from an initial stage.The polishing pad (1, 2) is composed of a highly rigid thermoplastic hard resin foam article having a three-dimensional cell structure partitioned by cell walls so as to have a plurality of cells andpartitions in which these cells are mutually independent. The polishing pad has a structure in which the tensile strength is 50-90 MPa, bending strength is 90-140 MPa, the tensile modulus of elasticity and the flexural elastic modulus are both 2400 MPa or greater, the average cell diameter is 4-50 micron, the average cell wall thickness is 1-5 micron, and the ratio of the average cell diameter tothe average cell wall thick</description><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZIgI8PfxDPbw9HNXCHB00VFAcH1dQzz8XRRCg8FyqKqgcm7-QVD5YEdPF1RFPAysaYk5xam8UJqbQdHNNcTZQze1ID8-tbggMTk1L7Uk3tnP0MDC2MTSwMzQ0ZgYNQDJxDDg</recordid><startdate>20180731</startdate><enddate>20180731</enddate><creator>YAMAMOTO SYUNJI</creator><creator>KUBOTA TETSUJI</creator><creator>YOKOTA NOBUTOSHI</creator><creator>TODA SADAYUKI</creator><creator>MASUDA MITSUO</creator><scope>EVB</scope></search><sort><creationdate>20180731</creationdate><title>POLISHING PAD, POLISHING METHOD USING POLISHING PAD, METHOD FOR USING SAID POLISHING PAD</title><author>YAMAMOTO SYUNJI ; KUBOTA TETSUJI ; YOKOTA NOBUTOSHI ; TODA SADAYUKI ; MASUDA MITSUO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN108349061A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2018</creationdate><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>YAMAMOTO SYUNJI</creatorcontrib><creatorcontrib>KUBOTA TETSUJI</creatorcontrib><creatorcontrib>YOKOTA NOBUTOSHI</creatorcontrib><creatorcontrib>TODA SADAYUKI</creatorcontrib><creatorcontrib>MASUDA MITSUO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YAMAMOTO SYUNJI</au><au>KUBOTA TETSUJI</au><au>YOKOTA NOBUTOSHI</au><au>TODA SADAYUKI</au><au>MASUDA MITSUO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>POLISHING PAD, POLISHING METHOD USING POLISHING PAD, METHOD FOR USING SAID POLISHING PAD</title><date>2018-07-31</date><risdate>2018</risdate><abstract>Provided is a polishing pad having a resin foam article composed of a thermoplastic resin with excellent re-polishing characteristics, the polishing pad being capable of eliminating or dramatically shortening pre-polishing time and realizing simple polishing, and being capable of highly reliable and efficient polishing by continuous polishing at an excellent polishing speed from an initial stage.The polishing pad (1, 2) is composed of a highly rigid thermoplastic hard resin foam article having a three-dimensional cell structure partitioned by cell walls so as to have a plurality of cells andpartitions in which these cells are mutually independent. The polishing pad has a structure in which the tensile strength is 50-90 MPa, bending strength is 90-140 MPa, the tensile modulus of elasticity and the flexural elastic modulus are both 2400 MPa or greater, the average cell diameter is 4-50 micron, the average cell wall thickness is 1-5 micron, and the ratio of the average cell diameter tothe average cell wall thick</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING |
| title | POLISHING PAD, POLISHING METHOD USING POLISHING PAD, METHOD FOR USING SAID POLISHING PAD |
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