Method for repairing SiC load bearing board or sagger and repairing bonding material
The invention discloses a method for repairing a SiC load bearing board or sagger and a repairing bonding material. Al2O3 powder with the particle size of 10-110 nm and SiO2 powder with the particle size of 30-100 nm are taken as repairing materials in the weight ratio being (1:5)-(1:2) and uniforml...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a method for repairing a SiC load bearing board or sagger and a repairing bonding material. Al2O3 powder with the particle size of 10-110 nm and SiO2 powder with the particle size of 30-100 nm are taken as repairing materials in the weight ratio being (1:5)-(1:2) and uniformly mixed with a solvent formed by epoxy resin glue, starch glue and ethylene glycol or glycerin to form the pasty repairing bonding material; the repairing bonding material is smeared to to-be-repaired section of a SiC load bearing board or sagger, pressure is applied, so that parts on two sides of the section are bonded and fixed, the repairing bonding material is sintered in the air atmosphere to be cured, and repairing is completed. The repairing bonding material has good sintering conglutination with the load bearing board or a sagger base body and also has appropriate elasticity modulus, secondary cracking of the repaired parts due to sintering stress is avoided, the repaired load bearing board or sagger has go |
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