Substrate structure
A substrate structure comprises a substrate body having a plurality of insulating layers and a circuit combination bonded to the substrate body and having a passive line, wherein at least the formingmaterial of the insulating layer is a high dielectric constant material, and the capacitor circuit of...
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| creator | LAI JIAZHU FANG BOXIANG SHI ZHIYUAN LIN HEQUAN CHEN GUANDA |
| description | A substrate structure comprises a substrate body having a plurality of insulating layers and a circuit combination bonded to the substrate body and having a passive line, wherein at least the formingmaterial of the insulating layer is a high dielectric constant material, and the capacitor circuit of the circuit combination is Formed on the insulating layer of the high-k material to maintain signal quality while reducing the overall line area of the line combination.
种基板结构，包括具多个绝缘层的基板本体以及结合至该基板本体且具有被动线路的线路组合，其中，至少该绝缘层的成形材料为高介电系数材料，使该线路组合的电容线路形成于该高介电系数材料的绝缘层上，以维持讯号品质，同时缩小该线路组合的整体线路面积。 |
| format | Patent |
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种基板结构，包括具多个绝缘层的基板本体以及结合至该基板本体且具有被动线路的线路组合，其中，至少该绝缘层的成形材料为高介电系数材料，使该线路组合的电容线路形成于该高介电系数材料的绝缘层上，以维持讯号品质，同时缩小该线路组合的整体线路面积。</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180720&DB=EPODOC&CC=CN&NR=108305862A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180720&DB=EPODOC&CC=CN&NR=108305862A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LAI JIAZHU</creatorcontrib><creatorcontrib>FANG BOXIANG</creatorcontrib><creatorcontrib>SHI ZHIYUAN</creatorcontrib><creatorcontrib>LIN HEQUAN</creatorcontrib><creatorcontrib>CHEN GUANDA</creatorcontrib><title>Substrate structure</title><description>A substrate structure comprises a substrate body having a plurality of insulating layers and a circuit combination bonded to the substrate body and having a passive line, wherein at least the formingmaterial of the insulating layer is a high dielectric constant material, and the capacitor circuit of the circuit combination is Formed on the insulating layer of the high-k material to maintain signal quality while reducing the overall line area of the line combination.
种基板结构，包括具多个绝缘层的基板本体以及结合至该基板本体且具有被动线路的线路组合，其中，至少该绝缘层的成形材料为高介电系数材料，使该线路组合的电容线路形成于该高介电系数材料的绝缘层上，以维持讯号品质，同时缩小该线路组合的整体线路面积。</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAOLk0qLilKLElVAFKlySWlRak8DKxpiTnFqbxQmptB0c01xNlDN7UgPz61uCAxOTUvtSTe2c_QwMLYwNTCzMjRmBg1AEuAIMo</recordid><startdate>20180720</startdate><enddate>20180720</enddate><creator>LAI JIAZHU</creator><creator>FANG BOXIANG</creator><creator>SHI ZHIYUAN</creator><creator>LIN HEQUAN</creator><creator>CHEN GUANDA</creator><scope>EVB</scope></search><sort><creationdate>20180720</creationdate><title>Substrate structure</title><author>LAI JIAZHU ; FANG BOXIANG ; SHI ZHIYUAN ; LIN HEQUAN ; CHEN GUANDA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN108305862A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2018</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>LAI JIAZHU</creatorcontrib><creatorcontrib>FANG BOXIANG</creatorcontrib><creatorcontrib>SHI ZHIYUAN</creatorcontrib><creatorcontrib>LIN HEQUAN</creatorcontrib><creatorcontrib>CHEN GUANDA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LAI JIAZHU</au><au>FANG BOXIANG</au><au>SHI ZHIYUAN</au><au>LIN HEQUAN</au><au>CHEN GUANDA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Substrate structure</title><date>2018-07-20</date><risdate>2018</risdate><abstract>A substrate structure comprises a substrate body having a plurality of insulating layers and a circuit combination bonded to the substrate body and having a passive line, wherein at least the formingmaterial of the insulating layer is a high dielectric constant material, and the capacitor circuit of the circuit combination is Formed on the insulating layer of the high-k material to maintain signal quality while reducing the overall line area of the line combination.
种基板结构，包括具多个绝缘层的基板本体以及结合至该基板本体且具有被动线路的线路组合，其中，至少该绝缘层的成形材料为高介电系数材料，使该线路组合的电容线路形成于该高介电系数材料的绝缘层上，以维持讯号品质，同时缩小该线路组合的整体线路面积。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Substrate structure |
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