Unit for supplying chemical, apparatus for treating substrate and method for removal bubble
Disclosed are an apparatus and a method for liquid-treating a substrate. The substrate treating apparatus includes a liquid supply unit configured to supply a treatment liquid in which a first liquidand a second liquid are mixed, onto the substrate unit, wherein the liquid supply unit includes a noz...
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| creator | KIM, JONGHAN JANG, YOUNG JIN CHOI, YOUNGJUN BANG, BYUNGSUN YU, JIN TACK |
| description | Disclosed are an apparatus and a method for liquid-treating a substrate. The substrate treating apparatus includes a liquid supply unit configured to supply a treatment liquid in which a first liquidand a second liquid are mixed, onto the substrate unit, wherein the liquid supply unit includes a nozzle configured to discharge the treatment liquid, a first liquid supply line supplying the first liquid to the nozzle, and a second liquid supply supplying the second liquid to the nozzle, and the nozzle includes a body having a mixing space in which the first liquid and the second liquid are mixedand a buffer space extending from the mixing space, in the interior thereof, and a collision member located in the buffer space and configured to decrease a flow velocity of the treatment liquid supplied to the buffer space.
公开了用于对基板进行液体处理的装置和方法。该基板处理装置包括：液体供应单元，其被构造成将混合有第液体和第二液体的处理液体供应到基板单元上，其中该液体供应单元包括：喷嘴，其被构造成排出处理液体；第液体供应管线，其将第液体供应到该喷嘴；以及第二液体供应管线，其将第二液体供应到该喷嘴，并且该喷嘴包括：主体，其在其内部具有供第液体和第二液体混合的混合空间以及从混合空间延伸的缓冲空间；以及碰撞构件，其位于缓 |
| format | Patent |
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公开了用于对基板进行液体处理的装置和方法。该基板处理装置包括：液体供应单元，其被构造成将混合有第液体和第二液体的处理液体供应到基板单元上，其中该液体供应单元包括：喷嘴，其被构造成排出处理液体；第液体供应管线，其将第液体供应到该喷嘴；以及第二液体供应管线，其将第二液体供应到该喷嘴，并且该喷嘴包括：主体，其在其内部具有供第液体和第二液体混合的混合空间以及从混合空间延伸的缓冲空间；以及碰撞构件，其位于缓</description><language>chi ; eng</language><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ; ATOMISING APPARATUS ; BASIC ELECTRIC ELEMENTS ; CLEANING ; CLEANING IN GENERAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MIXING, e.g. DISSOLVING, EMULSIFYING, DISPERSING ; NOZZLES ; PERFORMING OPERATIONS ; PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL ; PREVENTION OF FOULING IN GENERAL ; SEMICONDUCTOR DEVICES ; SPRAYING APPARATUS ; SPRAYING OR ATOMISING IN GENERAL ; TRANSPORTING</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180710&DB=EPODOC&CC=CN&NR=108269749A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180710&DB=EPODOC&CC=CN&NR=108269749A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KIM, JONGHAN</creatorcontrib><creatorcontrib>JANG, YOUNG JIN</creatorcontrib><creatorcontrib>CHOI, YOUNGJUN</creatorcontrib><creatorcontrib>BANG, BYUNGSUN</creatorcontrib><creatorcontrib>YU, JIN TACK</creatorcontrib><title>Unit for supplying chemical, apparatus for treating substrate and method for removal bubble</title><description>Disclosed are an apparatus and a method for liquid-treating a substrate. The substrate treating apparatus includes a liquid supply unit configured to supply a treatment liquid in which a first liquidand a second liquid are mixed, onto the substrate unit, wherein the liquid supply unit includes a nozzle configured to discharge the treatment liquid, a first liquid supply line supplying the first liquid to the nozzle, and a second liquid supply supplying the second liquid to the nozzle, and the nozzle includes a body having a mixing space in which the first liquid and the second liquid are mixedand a buffer space extending from the mixing space, in the interior thereof, and a collision member located in the buffer space and configured to decrease a flow velocity of the treatment liquid supplied to the buffer space.
公开了用于对基板进行液体处理的装置和方法。该基板处理装置包括：液体供应单元，其被构造成将混合有第液体和第二液体的处理液体供应到基板单元上，其中该液体供应单元包括：喷嘴，其被构造成排出处理液体；第液体供应管线，其将第液体供应到该喷嘴；以及第二液体供应管线，其将第二液体供应到该喷嘴，并且该喷嘴包括：主体，其在其内部具有供第液体和第二液体混合的混合空间以及从混合空间延伸的缓冲空间；以及碰撞构件，其位于缓</description><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</subject><subject>ATOMISING APPARATUS</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CLEANING</subject><subject>CLEANING IN GENERAL</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MIXING, e.g. DISSOLVING, EMULSIFYING, DISPERSING</subject><subject>NOZZLES</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL</subject><subject>PREVENTION OF FOULING IN GENERAL</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SPRAYING APPARATUS</subject><subject>SPRAYING OR ATOMISING IN GENERAL</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyrsKwkAQQNE0FqL-w9gr-EJNKUGxstLKIsxuJmZhH8PurODfq8EPsLpwOcPifvNGoA0RUma2L-MfoDtyRqOdATJjRMmpFxIJ5QtSVkk-nwB9A46kC00vIrnwRAsqK2VpXAxatIkmv46K6el4rc5z4lBTYtTkSerqslzsV9tytykP63_MG48WO8I</recordid><startdate>20180710</startdate><enddate>20180710</enddate><creator>KIM, JONGHAN</creator><creator>JANG, YOUNG JIN</creator><creator>CHOI, YOUNGJUN</creator><creator>BANG, BYUNGSUN</creator><creator>YU, JIN TACK</creator><scope>EVB</scope></search><sort><creationdate>20180710</creationdate><title>Unit for supplying chemical, apparatus for treating substrate and method for removal bubble</title><author>KIM, JONGHAN ; JANG, YOUNG JIN ; CHOI, YOUNGJUN ; BANG, BYUNGSUN ; YU, JIN TACK</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN108269749A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2018</creationdate><topic>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</topic><topic>ATOMISING APPARATUS</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CLEANING</topic><topic>CLEANING IN GENERAL</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MIXING, e.g. DISSOLVING, EMULSIFYING, DISPERSING</topic><topic>NOZZLES</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL</topic><topic>PREVENTION OF FOULING IN GENERAL</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SPRAYING APPARATUS</topic><topic>SPRAYING OR ATOMISING IN GENERAL</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>KIM, JONGHAN</creatorcontrib><creatorcontrib>JANG, YOUNG JIN</creatorcontrib><creatorcontrib>CHOI, YOUNGJUN</creatorcontrib><creatorcontrib>BANG, BYUNGSUN</creatorcontrib><creatorcontrib>YU, JIN TACK</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KIM, JONGHAN</au><au>JANG, YOUNG JIN</au><au>CHOI, YOUNGJUN</au><au>BANG, BYUNGSUN</au><au>YU, JIN TACK</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Unit for supplying chemical, apparatus for treating substrate and method for removal bubble</title><date>2018-07-10</date><risdate>2018</risdate><abstract>Disclosed are an apparatus and a method for liquid-treating a substrate. The substrate treating apparatus includes a liquid supply unit configured to supply a treatment liquid in which a first liquidand a second liquid are mixed, onto the substrate unit, wherein the liquid supply unit includes a nozzle configured to discharge the treatment liquid, a first liquid supply line supplying the first liquid to the nozzle, and a second liquid supply supplying the second liquid to the nozzle, and the nozzle includes a body having a mixing space in which the first liquid and the second liquid are mixedand a buffer space extending from the mixing space, in the interior thereof, and a collision member located in the buffer space and configured to decrease a flow velocity of the treatment liquid supplied to the buffer space.
公开了用于对基板进行液体处理的装置和方法。该基板处理装置包括：液体供应单元，其被构造成将混合有第液体和第二液体的处理液体供应到基板单元上，其中该液体供应单元包括：喷嘴，其被构造成排出处理液体；第液体供应管线，其将第液体供应到该喷嘴；以及第二液体供应管线，其将第二液体供应到该喷嘴，并且该喷嘴包括：主体，其在其内部具有供第液体和第二液体混合的混合空间以及从混合空间延伸的缓冲空间；以及碰撞构件，其位于缓</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ATOMISING APPARATUS BASIC ELECTRIC ELEMENTS CLEANING CLEANING IN GENERAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MIXING, e.g. DISSOLVING, EMULSIFYING, DISPERSING NOZZLES PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL PREVENTION OF FOULING IN GENERAL SEMICONDUCTOR DEVICES SPRAYING APPARATUS SPRAYING OR ATOMISING IN GENERAL TRANSPORTING |
| title | Unit for supplying chemical, apparatus for treating substrate and method for removal bubble |
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