Photocurable resin composition and sealant for electronic component

The invention relates to a photocurable resin composition and a sealant for an electronic component. The invention relates to a resin composition cured by light irradiation such as ultraviolet light or visible light, and a resin composition which is highly sensitive to light and sufficiently cured e...

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Bibliographische Detailangaben
Hauptverfasser:	TATENO MASAKI, TAKAYUKI TOSHIMA, NAOYUKI OCHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING DYES FREQUENCY-CHANGING METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-LINEAR OPTICS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PHYSICS POLISHES TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The invention relates to a photocurable resin composition and a sealant for an electronic component. The invention relates to a resin composition cured by light irradiation such as ultraviolet light or visible light, and a resin composition which is highly sensitive to light and sufficiently cured even with low-energy light. The photocurable resin composition contains a thioxanthone compound having nitrogen atoms in molecules (A). 本发明涉及光固化性树脂组合物和电子部件用密封剂。本发明涉及利用紫外线、可见光等光照射进行固化的树脂组合物，提出对光的灵敏度高、即使利用低能量光也充分固化的树脂组合物。种光固化性树脂组合物，其含有成分(A)在分子内具有氮原子的噻吨酮化合物。