Corrosion device and corrosion method for realizing relative rotation of adjacent wafers

The invention discloses a corrosion device and corrosion method for realizing relative rotation of adjacent wafers. The corrosion device is composed of a carrier, a mechanical arm, a corrosion processtank and a mixed acid tank. The carrier includes two groups of side plates and fixed rods fixed and...

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Hauptverfasser: BIAN YONGZHI, ZHANG LIANG, DU JUAN, CHENG FENGLING, NING YONGDUO
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Sprache:chi ; eng
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creator BIAN YONGZHI
ZHANG LIANG
DU JUAN
CHENG FENGLING
NING YONGDUO
description The invention discloses a corrosion device and corrosion method for realizing relative rotation of adjacent wafers. The corrosion device is composed of a carrier, a mechanical arm, a corrosion processtank and a mixed acid tank. The carrier includes two groups of side plates and fixed rods fixed and supported between the two side plates; and carrier center driving shafts, carrier center driving gear wheels, carrier driving gear wheels and reverse carrier driving gear wheels are installed at the two groups of side plates respectively. Fixed carrier sleeves are installed at the carrier center driving shafts. Four groups of toothed rotating rods including eight toothed rotating rods in total are installed between the two groups of side plates. The mechanical arm has carrier locking parts locked with the fixed sleeves at the two sides of the carrier, a mechanical arm transmission gear group, a carrier driving motor, and two carrier transmission gear groups. The bottom of the corrosion process tank is connected wit
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Corrosion device and corrosion method for realizing relative rotation of adjacent wafers
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