Ceramic PCB manufacturing process based on graphene material

The invention provides a ceramic PCB manufacturing process based on graphene material. The process comprises the steps of coating one surface of a copper belt substrate with a layer of photoreceptivewet film; according to a preset circuit diagram, using diagram film for conducting exposure and devel...

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Hauptverfasser: JIA CHANGWU, WU ZHAOXIONG
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creator JIA CHANGWU
WU ZHAOXIONG
description The invention provides a ceramic PCB manufacturing process based on graphene material. The process comprises the steps of coating one surface of a copper belt substrate with a layer of photoreceptivewet film; according to a preset circuit diagram, using diagram film for conducting exposure and development on the copper belt substrate coated with the photoreceptive wet film; placing the copper belt substrate with the wet film diagram in electroplate liquid for electroplating; removing the photoreceptive wet film in the copper belt substrate, with a preset thickness, of a metal wireline layer;forming a layer of graphene film on the other surface of the copper belt substrate with the preset circuit diagram; fitting the pre-obtained green body on the surface of the preset circuit diagram ofthe copper belt substrate; firing the copper belt substrate with the preset circuit diagram, which the green body fits, with a preset temperature lower than the metal wireline melting point to be integrated, a metal wireline wi
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN108200716A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN108200716A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN108200716A3</originalsourceid><addsrcrecordid>eNrjZLBxTi1KzM1MVghwdlLITcwrTUtMLiktysxLVygoyk9OLS5WSEosTk1RyM9TSC9KLMhIzUsFqitJLcpMzOFhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJQNUl8c5-hgYWRgYG5oZmjsbEqAEAs3AvZg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Ceramic PCB manufacturing process based on graphene material</title><source>esp@cenet</source><creator>JIA CHANGWU ; WU ZHAOXIONG</creator><creatorcontrib>JIA CHANGWU ; WU ZHAOXIONG</creatorcontrib><description>The invention provides a ceramic PCB manufacturing process based on graphene material. The process comprises the steps of coating one surface of a copper belt substrate with a layer of photoreceptivewet film; according to a preset circuit diagram, using diagram film for conducting exposure and development on the copper belt substrate coated with the photoreceptive wet film; placing the copper belt substrate with the wet film diagram in electroplate liquid for electroplating; removing the photoreceptive wet film in the copper belt substrate, with a preset thickness, of a metal wireline layer;forming a layer of graphene film on the other surface of the copper belt substrate with the preset circuit diagram; fitting the pre-obtained green body on the surface of the preset circuit diagram ofthe copper belt substrate; firing the copper belt substrate with the preset circuit diagram, which the green body fits, with a preset temperature lower than the metal wireline melting point to be integrated, a metal wireline wi</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20180622&amp;DB=EPODOC&amp;CC=CN&amp;NR=108200716A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20180622&amp;DB=EPODOC&amp;CC=CN&amp;NR=108200716A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>JIA CHANGWU</creatorcontrib><creatorcontrib>WU ZHAOXIONG</creatorcontrib><title>Ceramic PCB manufacturing process based on graphene material</title><description>The invention provides a ceramic PCB manufacturing process based on graphene material. The process comprises the steps of coating one surface of a copper belt substrate with a layer of photoreceptivewet film; according to a preset circuit diagram, using diagram film for conducting exposure and development on the copper belt substrate coated with the photoreceptive wet film; placing the copper belt substrate with the wet film diagram in electroplate liquid for electroplating; removing the photoreceptive wet film in the copper belt substrate, with a preset thickness, of a metal wireline layer;forming a layer of graphene film on the other surface of the copper belt substrate with the preset circuit diagram; fitting the pre-obtained green body on the surface of the preset circuit diagram ofthe copper belt substrate; firing the copper belt substrate with the preset circuit diagram, which the green body fits, with a preset temperature lower than the metal wireline melting point to be integrated, a metal wireline wi</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLBxTi1KzM1MVghwdlLITcwrTUtMLiktysxLVygoyk9OLS5WSEosTk1RyM9TSC9KLMhIzUsFqitJLcpMzOFhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJQNUl8c5-hgYWRgYG5oZmjsbEqAEAs3AvZg</recordid><startdate>20180622</startdate><enddate>20180622</enddate><creator>JIA CHANGWU</creator><creator>WU ZHAOXIONG</creator><scope>EVB</scope></search><sort><creationdate>20180622</creationdate><title>Ceramic PCB manufacturing process based on graphene material</title><author>JIA CHANGWU ; WU ZHAOXIONG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN108200716A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2018</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>JIA CHANGWU</creatorcontrib><creatorcontrib>WU ZHAOXIONG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>JIA CHANGWU</au><au>WU ZHAOXIONG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Ceramic PCB manufacturing process based on graphene material</title><date>2018-06-22</date><risdate>2018</risdate><abstract>The invention provides a ceramic PCB manufacturing process based on graphene material. The process comprises the steps of coating one surface of a copper belt substrate with a layer of photoreceptivewet film; according to a preset circuit diagram, using diagram film for conducting exposure and development on the copper belt substrate coated with the photoreceptive wet film; placing the copper belt substrate with the wet film diagram in electroplate liquid for electroplating; removing the photoreceptive wet film in the copper belt substrate, with a preset thickness, of a metal wireline layer;forming a layer of graphene film on the other surface of the copper belt substrate with the preset circuit diagram; fitting the pre-obtained green body on the surface of the preset circuit diagram ofthe copper belt substrate; firing the copper belt substrate with the preset circuit diagram, which the green body fits, with a preset temperature lower than the metal wireline melting point to be integrated, a metal wireline wi</abstract><oa>free_for_read</oa></addata></record>
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Ceramic PCB manufacturing process based on graphene material
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-06T15%3A44%3A17IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=JIA%20CHANGWU&rft.date=2018-06-22&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN108200716A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true