COMPOSITION FOR FORMING SILICA LAYER, METHOD FOR MANUFACTURING SILICA LAYER, AND ELECTRIC DEVICE
The invention relates to a composition for forming a silica layer, a method for manufacturing a silica layer, and an electric device. The composition for forming silica layer includes a silicon-containing polymer and a solvent, wherein a weight average molecular weight of the silicon-containing poly...
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| creator | KIM, JINGYO YUN, HUICHAN SIM, SOOYEON KWAK, TAEKSOO BAE, JIN-HEE LEE, JIHO HWANG, BYEONG GYU NOH, KUNBAE KIM, YONGGOOG |
| description | The invention relates to a composition for forming a silica layer, a method for manufacturing a silica layer, and an electric device. The composition for forming silica layer includes a silicon-containing polymer and a solvent, wherein a weight average molecular weight of the silicon-containing polymer ranges from about 2,000 to about 100,000 and a branching ratio (a) of the silicon-containing polymer calculated by Equation 1 ranges from about 0.25 to about 0.50. eta =k*Ma [Equation 1]. In Equation 1, eta is an intrinsic viscosity of a silicon-containing polymer, M is an absolute molecular weight of a silicon-containing polymer, a is a branching ratio, and k is an intrinsic constant. Accordingly, a silica layer manufactured using the composition for forming a silica layer may have a densestructure, and a shrinkage and a stress of a layer may be reduced and etch resistance and planarization characteristics may be improved.
本发明涉及种用于形成硅氧层的组成物、种制造硅氧层的方法及种电子装置，所述用于形成硅氧层的组成物包含含硅聚合物和溶剂，其中含硅聚合物的重量平均分子量在2,000到100,000范 |
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本发明涉及种用于形成硅氧层的组成物、种制造硅氧层的方法及种电子装置，所述用于形成硅氧层的组成物包含含硅聚合物和溶剂，其中含硅聚合物的重量平均分子量在2,000到100,000范</description><language>chi ; eng</language><subject>ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CHEMICAL PAINT OR INK REMOVERS ; CHEMISTRY ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; COMPOSITIONS BASED THEREON ; COMPOUNDS THEREOF ; CORRECTING FLUIDS ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FILLING PASTES ; INKS ; INORGANIC CHEMISTRY ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-METALLIC ELEMENTS ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; POLISHES ; SEMICONDUCTOR DEVICES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF MATERIALS THEREFOR ; WOODSTAINS</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180615&DB=EPODOC&CC=CN&NR=108164711A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180615&DB=EPODOC&CC=CN&NR=108164711A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KIM, JINGYO</creatorcontrib><creatorcontrib>YUN, HUICHAN</creatorcontrib><creatorcontrib>SIM, SOOYEON</creatorcontrib><creatorcontrib>KWAK, TAEKSOO</creatorcontrib><creatorcontrib>BAE, JIN-HEE</creatorcontrib><creatorcontrib>LEE, JIHO</creatorcontrib><creatorcontrib>HWANG, BYEONG GYU</creatorcontrib><creatorcontrib>NOH, KUNBAE</creatorcontrib><creatorcontrib>KIM, YONGGOOG</creatorcontrib><title>COMPOSITION FOR FORMING SILICA LAYER, METHOD FOR MANUFACTURING SILICA LAYER, AND ELECTRIC DEVICE</title><description>The invention relates to a composition for forming a silica layer, a method for manufacturing a silica layer, and an electric device. The composition for forming silica layer includes a silicon-containing polymer and a solvent, wherein a weight average molecular weight of the silicon-containing polymer ranges from about 2,000 to about 100,000 and a branching ratio (a) of the silicon-containing polymer calculated by Equation 1 ranges from about 0.25 to about 0.50. eta =k*Ma [Equation 1]. In Equation 1, eta is an intrinsic viscosity of a silicon-containing polymer, M is an absolute molecular weight of a silicon-containing polymer, a is a branching ratio, and k is an intrinsic constant. Accordingly, a silica layer manufactured using the composition for forming a silica layer may have a densestructure, and a shrinkage and a stress of a layer may be reduced and etch resistance and planarization characteristics may be improved.
本发明涉及种用于形成硅氧层的组成物、种制造硅氧层的方法及种电子装置，所述用于形成硅氧层的组成物包含含硅聚合物和溶剂，其中含硅聚合物的重量平均分子量在2,000到100,000范</description><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL PAINT OR INK REMOVERS</subject><subject>CHEMISTRY</subject><subject>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOUNDS THEREOF</subject><subject>CORRECTING FLUIDS</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FILLING PASTES</subject><subject>INKS</subject><subject>INORGANIC CHEMISTRY</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-METALLIC ELEMENTS</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>PASTES OR SOLIDS FOR COLOURING OR PRINTING</subject><subject>POLISHES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF MATERIALS THEREFOR</subject><subject>WOODSTAINS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZEhw9vcN8A_2DPH091Nw8w8CYV9PP3eFYE8fT2dHBR_HSNcgHQVf1xAPfxewAl9Hv1A3R-eQ0CBMZY5-LgquPq7OIUGezgourmGezq48DKxpiTnFqbxQmptB0c01xNlDN7UgPz61uCAxOTUvtSTe2c_QwMLQzMTc0NDRmBg1AGVNMxQ</recordid><startdate>20180615</startdate><enddate>20180615</enddate><creator>KIM, JINGYO</creator><creator>YUN, HUICHAN</creator><creator>SIM, SOOYEON</creator><creator>KWAK, TAEKSOO</creator><creator>BAE, JIN-HEE</creator><creator>LEE, JIHO</creator><creator>HWANG, BYEONG GYU</creator><creator>NOH, KUNBAE</creator><creator>KIM, YONGGOOG</creator><scope>EVB</scope></search><sort><creationdate>20180615</creationdate><title>COMPOSITION FOR FORMING SILICA LAYER, METHOD FOR MANUFACTURING SILICA LAYER, AND ELECTRIC DEVICE</title><author>KIM, JINGYO ; YUN, HUICHAN ; SIM, SOOYEON ; KWAK, TAEKSOO ; BAE, JIN-HEE ; LEE, JIHO ; HWANG, BYEONG GYU ; NOH, KUNBAE ; KIM, YONGGOOG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN108164711A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2018</creationdate><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL PAINT OR INK REMOVERS</topic><topic>CHEMISTRY</topic><topic>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOUNDS THEREOF</topic><topic>CORRECTING FLUIDS</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FILLING PASTES</topic><topic>INKS</topic><topic>INORGANIC CHEMISTRY</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-METALLIC ELEMENTS</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>PASTES OR SOLIDS FOR COLOURING OR PRINTING</topic><topic>POLISHES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF MATERIALS THEREFOR</topic><topic>WOODSTAINS</topic><toplevel>online_resources</toplevel><creatorcontrib>KIM, JINGYO</creatorcontrib><creatorcontrib>YUN, HUICHAN</creatorcontrib><creatorcontrib>SIM, SOOYEON</creatorcontrib><creatorcontrib>KWAK, TAEKSOO</creatorcontrib><creatorcontrib>BAE, JIN-HEE</creatorcontrib><creatorcontrib>LEE, JIHO</creatorcontrib><creatorcontrib>HWANG, BYEONG GYU</creatorcontrib><creatorcontrib>NOH, KUNBAE</creatorcontrib><creatorcontrib>KIM, YONGGOOG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KIM, JINGYO</au><au>YUN, HUICHAN</au><au>SIM, SOOYEON</au><au>KWAK, TAEKSOO</au><au>BAE, JIN-HEE</au><au>LEE, JIHO</au><au>HWANG, BYEONG GYU</au><au>NOH, KUNBAE</au><au>KIM, YONGGOOG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>COMPOSITION FOR FORMING SILICA LAYER, METHOD FOR MANUFACTURING SILICA LAYER, AND ELECTRIC DEVICE</title><date>2018-06-15</date><risdate>2018</risdate><abstract>The invention relates to a composition for forming a silica layer, a method for manufacturing a silica layer, and an electric device. The composition for forming silica layer includes a silicon-containing polymer and a solvent, wherein a weight average molecular weight of the silicon-containing polymer ranges from about 2,000 to about 100,000 and a branching ratio (a) of the silicon-containing polymer calculated by Equation 1 ranges from about 0.25 to about 0.50. eta =k*Ma [Equation 1]. In Equation 1, eta is an intrinsic viscosity of a silicon-containing polymer, M is an absolute molecular weight of a silicon-containing polymer, a is a branching ratio, and k is an intrinsic constant. Accordingly, a silica layer manufactured using the composition for forming a silica layer may have a densestructure, and a shrinkage and a stress of a layer may be reduced and etch resistance and planarization characteristics may be improved.
本发明涉及种用于形成硅氧层的组成物、种制造硅氧层的方法及种电子装置，所述用于形成硅氧层的组成物包含含硅聚合物和溶剂，其中含硅聚合物的重量平均分子量在2,000到100,000范</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVES BASIC ELECTRIC ELEMENTS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON COMPOUNDS THEREOF CORRECTING FLUIDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES INKS INORGANIC CHEMISTRY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-METALLIC ELEMENTS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS THEREFOR WOODSTAINS |
| title | COMPOSITION FOR FORMING SILICA LAYER, METHOD FOR MANUFACTURING SILICA LAYER, AND ELECTRIC DEVICE |
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