Integrated Circuit Package For Assembling Various Dice In A Single IC Package

An integrated circuit IC package with one or more pins protruding from the IC package for electrically connecting the IC package with a printed circuit board PCB is presented. The IC package has a first die with a first electronic component, a second die with a second electronic component, and a con...

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Bibliographische Detailangaben

Hauptverfasser:	CANETE JR BALTAZAR, MARTIN MELVIN, AIYANDRA RAJESH, CAMPOS MACARIO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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