System for adjusting relative positions between components of bonding apparatus

A bonding apparatus comprises a movable bond head collet, a reference marker configured to move with the bond head collet, a flip head collet, first and second imaging devices and an adjusting mechanism. In use, the first imaging device captures one or more images of the reference marker and the flip head collet, and the second imaging device captures one or more images of the reference marker andthe bond head collet. The adjusting mechanism aligns a position of the bond head collet with a position of the flip head collet based on an offset that is determined from the images of the flip headcollet, bond head collet and reference marker. The flip head collet retrieves an electrical component and transfers the electrical component to the bond head collet at the alignment position. 本发明接合装置包括可移动接合头夹头、配置为与接合头夹头起移动的参考标记、翻转头夹头、第和第二成像装置和调整机构。在使用中，第成像装置捕获参考标记和翻转头夹头的个或多个图像，以及第二成像装置捕获参考标记和接合头夹头的个或多个图像。基于从翻转头夹头、接合头夹头和参考标记的图像确定的偏移，调整机构将接合头夹头的位置与翻转头夹头的位置对准。翻转头夹头拾取电气部件，并将电气部件传送给在对准位置的接合头夹头。