Circuit board and fabrication method and application thereof
The invention relates to a circuit board and a fabrication method and application thereof. The fabrication method comprises the steps of taking glass or acrylic as a circuit board bearing body; sequentially sputtering a first metal film layer, a second metal film layer and a third metal film layer o...
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| creator | CHEN WANGSHOU |
| description | The invention relates to a circuit board and a fabrication method and application thereof. The fabrication method comprises the steps of taking glass or acrylic as a circuit board bearing body; sequentially sputtering a first metal film layer, a second metal film layer and a third metal film layer on the bearing body by a magnetron sputtering method; evaporating a first copper film layer on the third metal film layer by an evaporation method; electroplating a second copper film layer on the first copper film layer by a water-based electroplating method, wherein the thickness of the first metalfilm layer is 10-80 nanometers, the thickness of the second metal film layer is not smaller than the thickness of the first metal film layer and is below 100 nanometers, the thickness of the third metal film layer is smaller than the thickness of the second metal film layer and is below 300 nanometers, the thickness of the first copper film layer is larger than the thickness of the third metal film layer and is below 500 |
| format | Patent |
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The fabrication method comprises the steps of taking glass or acrylic as a circuit board bearing body; sequentially sputtering a first metal film layer, a second metal film layer and a third metal film layer on the bearing body by a magnetron sputtering method; evaporating a first copper film layer on the third metal film layer by an evaporation method; electroplating a second copper film layer on the first copper film layer by a water-based electroplating method, wherein the thickness of the first metalfilm layer is 10-80 nanometers, the thickness of the second metal film layer is not smaller than the thickness of the first metal film layer and is below 100 nanometers, the thickness of the third metal film layer is smaller than the thickness of the second metal film layer and is below 300 nanometers, the thickness of the first copper film layer is larger than the thickness of the third metal film layer and is below 500</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180518&DB=EPODOC&CC=CN&NR=108055790A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180518&DB=EPODOC&CC=CN&NR=108055790A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHEN WANGSHOU</creatorcontrib><title>Circuit board and fabrication method and application thereof</title><description>The invention relates to a circuit board and a fabrication method and application thereof. 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| language | chi ; eng |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Circuit board and fabrication method and application thereof |
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