HEAT SINK MOUNTING SYSTEM FOR SEMICONDUCTOR DEVICES

A method of mounting a semiconductor device (4) to a heat sink (8) where an opening (12) in the circuit board (6) is formed and sized to allow the semiconductor device (4) to pass therethrough, where a heat sink (8) is positioned on one side of the circuit board (6) and a load is introduced on a sec...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ARDEN MARCUS MCCONNELL, MARK LORING LANTING, FREDERICK GERALD GOESCHEL
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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