THERMAL HEAD AND THERMAL PRINTER

A thermal head X1 is provided with: a substrate 7; a heat generating unit 9 that is provided on the substrate 7; a plurality of drive ICs 11 for controlling drive of the heat generating units 9, saiddrive ICs being provided on the substrate 7; and a coating member 29 covering the drive ICs 11. The c...

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Bibliographische Detailangaben
Hauptverfasser:	WATANABE MAKOTO, TAKADA HISATOSHI, SETO TATSURU, OKAYAMA ARATA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CORRECTION OF TYPOGRAPHICAL ERRORS i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME LINING MACHINES PERFORMING OPERATIONS PRINTING SELECTIVE PRINTING MECHANISMS STAMPS TRANSPORTING TYPEWRITERS
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Beschreibung
Zusammenfassung:	A thermal head X1 is provided with: a substrate 7; a heat generating unit 9 that is provided on the substrate 7; a plurality of drive ICs 11 for controlling drive of the heat generating units 9, saiddrive ICs being provided on the substrate 7; and a coating member 29 covering the drive ICs 11. The coating member 29 has: a first portion 29a formed by vertically extending an inter-IC region 18 provided between the adjacent drive ICs 11; a second portion 29b that is provided under each of the drive ICs 11; and a third portion 29c that is provided on each of the drive ICs 11. The first portion 29a has a first gap 16a. 热敏头(X1)具备：基板(7)；发热部(9)，设置在基板(7)上；多个驱动IC(11)，设置在基板(7)上，用于控制发热部(9)的驱动；以及被覆构件(29)，被覆多个驱动IC(11)。被覆构件(29)具有：第部位(29a)，将设置在相邻的驱动IC(11)间的IC间区域(18)向上下拉伸而成；第二部位(29b)，设置在驱动IC(11)之下；以及第三部位(29c)，设置在驱动IC(11)之上。第部位(29a)具有第空隙(16a)。