MULTILAYER ELECTRONIC COMPONENT

The invention provides a multilayer electronic component. The multilayer electronic component includes first and second external electrodes disposed on one surface of the body, the first internal electrode and the first external electrode being connected by a first via disposed within the body, the...

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Hauptverfasser: CHONG WON SIK, JANG YOUNG SU, HWANG MIN HA, LIM JUN BOUM
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Sprache:chi ; eng
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creator CHONG WON SIK
JANG YOUNG SU
HWANG MIN HA
LIM JUN BOUM
description The invention provides a multilayer electronic component. The multilayer electronic component includes first and second external electrodes disposed on one surface of the body, the first internal electrode and the first external electrode being connected by a first via disposed within the body, the second internal electrode and the second external electrode being connected by a second via disposedwithin the body, the first internal electrode including first and second through portions, and the second internal electrode including third and fourth through portions, the first via penetrating alternately through the first through portion and the third through portion, the second via penetrating alternately through the second through portion and the fourth through portion, and a lead portion of the first via being connected to one end portion of the first external electrode, and a lead portion of the second via being connected to one end portion of the second external electrode. 本发明提供种多层电子组件,所述多层电子组件包括设置在所述主体的个表面上
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The multilayer electronic component includes first and second external electrodes disposed on one surface of the body, the first internal electrode and the first external electrode being connected by a first via disposed within the body, the second internal electrode and the second external electrode being connected by a second via disposedwithin the body, the first internal electrode including first and second through portions, and the second internal electrode including third and fourth through portions, the first via penetrating alternately through the first through portion and the third through portion, the second via penetrating alternately through the second through portion and the fourth through portion, and a lead portion of the first via being connected to one end portion of the first external electrode, and a lead portion of the second via being connected to one end portion of the second external electrode. 本发明提供种多层电子组件,所述多层电子组件包括设置在所述主体的个表面上</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CAPACITORS ; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE ; ELECTRICITY</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20180508&amp;DB=EPODOC&amp;CC=CN&amp;NR=108010721A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20180508&amp;DB=EPODOC&amp;CC=CN&amp;NR=108010721A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHONG WON SIK</creatorcontrib><creatorcontrib>JANG YOUNG SU</creatorcontrib><creatorcontrib>HWANG MIN HA</creatorcontrib><creatorcontrib>LIM JUN BOUM</creatorcontrib><title>MULTILAYER ELECTRONIC COMPONENT</title><description>The invention provides a multilayer electronic component. 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language chi ; eng
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subjects BASIC ELECTRIC ELEMENTS
CAPACITORS
CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
ELECTRICITY
title MULTILAYER ELECTRONIC COMPONENT
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