HF Module

The invention relates to an HF module, which includes a bulk semiconductor substrate with at least one integrated HF component integrated in a first main surface region of the bulk semiconductor substrate. The bulk semiconductor substrate is further provided with a second main surface region and a s...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CARSTEN AHRENS, CARSTEN VON KOBLINSKI, KATHARINA UMMINGER
Format: Patent
Sprache:chi ; eng
Schlagworte:
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