FLEXIBLE CIRCUITS FOR MOUNTING LIGHT EMITTING SEMICONDUCTOR DEVICE
A flexible dielectric substrate (102) defines a LESD mounting region (120) including two conductive filled vias (105, 106) extending through the flexible dielectric substrate (102) and the LESD mounting region is substantially surrounded by two conductive frame portions (112, 116). The frame portion...
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| creator | PALANISWAMY RAVI NARAG ALEJANDRO ALDRIN II A |
| description | A flexible dielectric substrate (102) defines a LESD mounting region (120) including two conductive filled vias (105, 106) extending through the flexible dielectric substrate (102) and the LESD mounting region is substantially surrounded by two conductive frame portions (112, 116). The frame portions are in electrical connection with the conductive filled vias (105, 106), respectively. The conductive filled vias (105, 106) form conductive features in the mounting region (120) that are co-planar with each other.
柔性介电基板(102)限定LESD安装区域(120)，该LESD安装区域(120)包括延伸穿过柔性介电基板(102)的两个导电填充通孔(105,106)，并且LESD安装区域大体上被两个导电框架部分(112,116)包围。框架部分分别与导电填充通孔(105,106)电连接。导电填充通孔(102,103)在彼此共面的安装区域(120)中形成导电特征部。 |
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柔性介电基板(102)限定LESD安装区域(120)，该LESD安装区域(120)包括延伸穿过柔性介电基板(102)的两个导电填充通孔(105,106)，并且LESD安装区域大体上被两个导电框架部分(112,116)包围。框架部分分别与导电填充通孔(105,106)电连接。导电填充通孔(102,103)在彼此共面的安装区域(120)中形成导电特征部。</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180417&DB=EPODOC&CC=CN&NR=107924973A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180417&DB=EPODOC&CC=CN&NR=107924973A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>PALANISWAMY RAVI</creatorcontrib><creatorcontrib>NARAG ALEJANDRO ALDRIN II A</creatorcontrib><title>FLEXIBLE CIRCUITS FOR MOUNTING LIGHT EMITTING SEMICONDUCTOR DEVICE</title><description>A flexible dielectric substrate (102) defines a LESD mounting region (120) including two conductive filled vias (105, 106) extending through the flexible dielectric substrate (102) and the LESD mounting region is substantially surrounded by two conductive frame portions (112, 116). The frame portions are in electrical connection with the conductive filled vias (105, 106), respectively. The conductive filled vias (105, 106) form conductive features in the mounting region (120) that are co-planar with each other.
柔性介电基板(102)限定LESD安装区域(120)，该LESD安装区域(120)包括延伸穿过柔性介电基板(102)的两个导电填充通孔(105,106)，并且LESD安装区域大体上被两个导电框架部分(112,116)包围。框架部分分别与导电填充通孔(105,106)电连接。导电填充通孔(102,103)在彼此共面的安装区域(120)中形成导电特征部。</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHBy83GN8HTycVVw9gxyDvUMCVZw8w9S8PUP9Qvx9HNX8PF09whRcPX1DAFzg4EsZ38_l1DnEKAqF9cwT2dXHgbWtMSc4lReKM3NoOjmGuLsoZtakB-fWlyQmJyal1oS7-xnaGBuaWRiaW7saEyMGgAjxSuO</recordid><startdate>20180417</startdate><enddate>20180417</enddate><creator>PALANISWAMY RAVI</creator><creator>NARAG ALEJANDRO ALDRIN II A</creator><scope>EVB</scope></search><sort><creationdate>20180417</creationdate><title>FLEXIBLE CIRCUITS FOR MOUNTING LIGHT EMITTING SEMICONDUCTOR DEVICE</title><author>PALANISWAMY RAVI ; NARAG ALEJANDRO ALDRIN II A</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN107924973A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2018</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>PALANISWAMY RAVI</creatorcontrib><creatorcontrib>NARAG ALEJANDRO ALDRIN II A</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>PALANISWAMY RAVI</au><au>NARAG ALEJANDRO ALDRIN II A</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>FLEXIBLE CIRCUITS FOR MOUNTING LIGHT EMITTING SEMICONDUCTOR DEVICE</title><date>2018-04-17</date><risdate>2018</risdate><abstract>A flexible dielectric substrate (102) defines a LESD mounting region (120) including two conductive filled vias (105, 106) extending through the flexible dielectric substrate (102) and the LESD mounting region is substantially surrounded by two conductive frame portions (112, 116). The frame portions are in electrical connection with the conductive filled vias (105, 106), respectively. The conductive filled vias (105, 106) form conductive features in the mounting region (120) that are co-planar with each other.
柔性介电基板(102)限定LESD安装区域(120)，该LESD安装区域(120)包括延伸穿过柔性介电基板(102)的两个导电填充通孔(105,106)，并且LESD安装区域大体上被两个导电框架部分(112,116)包围。框架部分分别与导电填充通孔(105,106)电连接。导电填充通孔(102,103)在彼此共面的安装区域(120)中形成导电特征部。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | FLEXIBLE CIRCUITS FOR MOUNTING LIGHT EMITTING SEMICONDUCTOR DEVICE |
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