MOLD AND THERMOFORMING PROCESS USING THE SAME
The invention provides a mold and a thermoforming process using the same. The invention is used for forming thermosetting material. The mold includes a male mold and a female mold capable for thermaldecomposition. The male mold is in a rigid state when the temperature is lower than the thermal decom...
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creator | JWO SHYI-LIANG KAO HANANG HSU JUI-TING |
description | The invention provides a mold and a thermoforming process using the same. The invention is used for forming thermosetting material. The mold includes a male mold and a female mold capable for thermaldecomposition. The male mold is in a rigid state when the temperature is lower than the thermal decomposition temperature of the male mold. The male mold starts decomposition when the temperature equals to the thermal decomposition of the male mode. The curing temperature of thermosetting material is lower than or equal to the thermal decomposition starting temperature of the male mode. The femalemode is in the rigid state when the temperature is lower than the softening temperature of the female mode. The softening temperature of the female mode is higher than the thermal decomposition temperature of the male mode. According to the invention, a work piece and a thermal decomposition male mode are formed by the aid of the curing presoaking material overlapping layer. The work piece can beremoved easily since the m |
format | Patent |
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The mold includes a male mold and a female mold capable for thermaldecomposition. The male mold is in a rigid state when the temperature is lower than the thermal decomposition temperature of the male mold. The male mold starts decomposition when the temperature equals to the thermal decomposition of the male mode. The curing temperature of thermosetting material is lower than or equal to the thermal decomposition starting temperature of the male mode. The femalemode is in the rigid state when the temperature is lower than the softening temperature of the female mode. The softening temperature of the female mode is higher than the thermal decomposition temperature of the male mode. According to the invention, a work piece and a thermal decomposition male mode are formed by the aid of the curing presoaking material overlapping layer. The work piece can beremoved easily since the m</description><language>chi ; eng</language><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ; PERFORMING OPERATIONS ; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR ; SHAPING OR JOINING OF PLASTICS ; TRANSPORTING ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180417&DB=EPODOC&CC=CN&NR=107914407A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180417&DB=EPODOC&CC=CN&NR=107914407A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>JWO SHYI-LIANG</creatorcontrib><creatorcontrib>KAO HANANG</creatorcontrib><creatorcontrib>HSU JUI-TING</creatorcontrib><title>MOLD AND THERMOFORMING PROCESS USING THE SAME</title><description>The invention provides a mold and a thermoforming process using the same. The invention is used for forming thermosetting material. The mold includes a male mold and a female mold capable for thermaldecomposition. The male mold is in a rigid state when the temperature is lower than the thermal decomposition temperature of the male mold. The male mold starts decomposition when the temperature equals to the thermal decomposition of the male mode. The curing temperature of thermosetting material is lower than or equal to the thermal decomposition starting temperature of the male mode. The femalemode is in the rigid state when the temperature is lower than the softening temperature of the female mode. The softening temperature of the female mode is higher than the thermal decomposition temperature of the male mode. According to the invention, a work piece and a thermal decomposition male mode are formed by the aid of the curing presoaking material overlapping layer. The work piece can beremoved easily since the m</description><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</subject><subject>PERFORMING OPERATIONS</subject><subject>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</subject><subject>SHAPING OR JOINING OF PLASTICS</subject><subject>TRANSPORTING</subject><subject>WORKING OF PLASTICS</subject><subject>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZND19fdxUXD0c1EI8XAN8vV38w_y9fRzVwgI8nd2DQ5WCA0G8YByCsGOvq48DKxpiTnFqbxQmptB0c01xNlDN7UgPz61uCAxOTUvtSTe2c_QwNzS0MTEwNzRmBg1ALZaJWI</recordid><startdate>20180417</startdate><enddate>20180417</enddate><creator>JWO SHYI-LIANG</creator><creator>KAO HANANG</creator><creator>HSU JUI-TING</creator><scope>EVB</scope></search><sort><creationdate>20180417</creationdate><title>MOLD AND THERMOFORMING PROCESS USING THE SAME</title><author>JWO SHYI-LIANG ; KAO HANANG ; HSU JUI-TING</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN107914407A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2018</creationdate><topic>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</topic><topic>PERFORMING OPERATIONS</topic><topic>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</topic><topic>SHAPING OR JOINING OF PLASTICS</topic><topic>TRANSPORTING</topic><topic>WORKING OF PLASTICS</topic><topic>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</topic><toplevel>online_resources</toplevel><creatorcontrib>JWO SHYI-LIANG</creatorcontrib><creatorcontrib>KAO HANANG</creatorcontrib><creatorcontrib>HSU JUI-TING</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>JWO SHYI-LIANG</au><au>KAO HANANG</au><au>HSU JUI-TING</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MOLD AND THERMOFORMING PROCESS USING THE SAME</title><date>2018-04-17</date><risdate>2018</risdate><abstract>The invention provides a mold and a thermoforming process using the same. The invention is used for forming thermosetting material. The mold includes a male mold and a female mold capable for thermaldecomposition. The male mold is in a rigid state when the temperature is lower than the thermal decomposition temperature of the male mold. The male mold starts decomposition when the temperature equals to the thermal decomposition of the male mode. The curing temperature of thermosetting material is lower than or equal to the thermal decomposition starting temperature of the male mode. The femalemode is in the rigid state when the temperature is lower than the softening temperature of the female mode. The softening temperature of the female mode is higher than the thermal decomposition temperature of the male mode. According to the invention, a work piece and a thermal decomposition male mode are formed by the aid of the curing presoaking material overlapping layer. The work piece can beremoved easily since the m</abstract><oa>free_for_read</oa></addata></record> |
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subjects | AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
title | MOLD AND THERMOFORMING PROCESS USING THE SAME |
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