Semiconductor wafer box cleaning, drying and storing integrated method and device
The invention provides a semiconductor wafer box cleaning, drying and storing integrated method and device. The device comprises a control module, a wafer box loading unit, a wafer box cleaning unit,a wafer box drying unit, a wafer box storing unit, a wafer box unloading unit, a wafer box carrier an...
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| creator | ZHAO HOUYING |
| description | The invention provides a semiconductor wafer box cleaning, drying and storing integrated method and device. The device comprises a control module, a wafer box loading unit, a wafer box cleaning unit,a wafer box drying unit, a wafer box storing unit, a wafer box unloading unit, a wafer box carrier and a conveying device of the wafer box carrier. According to the method, the wafer box carrier loadsa wafer box, and the wafer box and the wafer box carrier are subjected to ultrasonic or megasonic cleaning together; the cleaned wafer box and the wafer box carrier are subjected to vacuum drying together; the wafer box subjected to vacuum drying and the wafer box carrier are stored together; and the stored wafer box and the wafer box carrier are taken out together, and the wafer box is unloadedfrom the wafer box carrier. According to the semiconductor wafer box cleaning, drying and storing integrated method and device, integration of cleaning, drying and storing of the semiconductor wafer box can be achieved, the cle |
| format | Patent |
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The device comprises a control module, a wafer box loading unit, a wafer box cleaning unit,a wafer box drying unit, a wafer box storing unit, a wafer box unloading unit, a wafer box carrier and a conveying device of the wafer box carrier. According to the method, the wafer box carrier loadsa wafer box, and the wafer box and the wafer box carrier are subjected to ultrasonic or megasonic cleaning together; the cleaned wafer box and the wafer box carrier are subjected to vacuum drying together; the wafer box subjected to vacuum drying and the wafer box carrier are stored together; and the stored wafer box and the wafer box carrier are taken out together, and the wafer box is unloadedfrom the wafer box carrier. According to the semiconductor wafer box cleaning, drying and storing integrated method and device, integration of cleaning, drying and storing of the semiconductor wafer box can be achieved, the cle</description><language>chi ; eng</language><subject>BLASTING ; CLEANING ; CLEANING IN GENERAL ; DRYING ; DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM ; HEATING ; LIGHTING ; MECHANICAL ENGINEERING ; PERFORMING OPERATIONS ; PREVENTION OF FOULING IN GENERAL ; TRANSPORTING ; WEAPONS</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180403&DB=EPODOC&CC=CN&NR=107866410A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25547,76298</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180403&DB=EPODOC&CC=CN&NR=107866410A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ZHAO HOUYING</creatorcontrib><title>Semiconductor wafer box cleaning, drying and storing integrated method and device</title><description>The invention provides a semiconductor wafer box cleaning, drying and storing integrated method and device. The device comprises a control module, a wafer box loading unit, a wafer box cleaning unit,a wafer box drying unit, a wafer box storing unit, a wafer box unloading unit, a wafer box carrier and a conveying device of the wafer box carrier. According to the method, the wafer box carrier loadsa wafer box, and the wafer box and the wafer box carrier are subjected to ultrasonic or megasonic cleaning together; the cleaned wafer box and the wafer box carrier are subjected to vacuum drying together; the wafer box subjected to vacuum drying and the wafer box carrier are stored together; and the stored wafer box and the wafer box carrier are taken out together, and the wafer box is unloadedfrom the wafer box carrier. 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The device comprises a control module, a wafer box loading unit, a wafer box cleaning unit,a wafer box drying unit, a wafer box storing unit, a wafer box unloading unit, a wafer box carrier and a conveying device of the wafer box carrier. According to the method, the wafer box carrier loadsa wafer box, and the wafer box and the wafer box carrier are subjected to ultrasonic or megasonic cleaning together; the cleaned wafer box and the wafer box carrier are subjected to vacuum drying together; the wafer box subjected to vacuum drying and the wafer box carrier are stored together; and the stored wafer box and the wafer box carrier are taken out together, and the wafer box is unloadedfrom the wafer box carrier. According to the semiconductor wafer box cleaning, drying and storing integrated method and device, integration of cleaning, drying and storing of the semiconductor wafer box can be achieved, the cle</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN107866410A |
| source | esp@cenet |
| subjects | BLASTING CLEANING CLEANING IN GENERAL DRYING DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM HEATING LIGHTING MECHANICAL ENGINEERING PERFORMING OPERATIONS PREVENTION OF FOULING IN GENERAL TRANSPORTING WEAPONS |
| title | Semiconductor wafer box cleaning, drying and storing integrated method and device |
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