Electronic devices comprising a via and methods of forming such electronic devices

A composite article includes a conductive layer with nanowires on at least a portion of a flexible substrate, wherein the conductive layer has a conductive surface. A patterned layer of a low surfaceenergy material is on a first region of the conductive surface. An overcoat layer free of conductive particulates is on a first portion of a second region of the conductive surface unoccupied by the patterned layer. A via is in a second portion of the second region of the conductive surface between an edge of the patterned layer of the low surface energy material and the overcoat layer. A conductive material is in the via to provide an electrical connection to the conductive surface. 本发明提供了种复合制品，该复合制品包括位于柔性基底的至少部分上的具有纳米线的导电层，其中导电层具有导电表面。低表面能材料的图案化层位于导电表面的第区域上。不含导电颗粒的外覆层位于未被图案化层占据的导电表面的第二区域的第部分上。通孔位于低表面能材料的图案化层的边缘和外覆层之间的导电表面的第二区域的第二部分中。导电材料位于通孔中，以提供到导电表面的电连接。