Combined photo and chemical sintering of a nano-conductive particles deposition layer
The material properties of structures made with conductive nanoparticles are enhanced by radiation sintering followed by chemical sintering. The conductive nanoparticles may be applied to substrates by methods such as screen printing, inkjet, aerosol and electrospinning and then sintering the conduc...
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| creator | BASHIR MUBASHER A RENNY JOSEPH S DE GRAAF MICHAEL A CLARACQ JEROME PROT STEFAN |
| description | The material properties of structures made with conductive nanoparticles are enhanced by radiation sintering followed by chemical sintering. The conductive nanoparticles may be applied to substrates by methods such as screen printing, inkjet, aerosol and electrospinning and then sintering the conductive nanoparticles on the substrates.
由导电的纳米粒子制备的结构的材料特性通过辐射烧结接着化学烧结增强。导电的纳米粒子可通过如丝网印刷、喷墨、气溶胶和电纺丝的方法涂覆到衬底，且随后烧结衬底上的导电的纳米粒子。 |
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由导电的纳米粒子制备的结构的材料特性通过辐射烧结接着化学烧结增强。导电的纳米粒子可通过如丝网印刷、喷墨、气溶胶和电纺丝的方法涂覆到衬底，且随后烧结衬底上的导电的纳米粒子。</description><language>chi ; eng</language><subject>ADHESIVES ; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; ALLOYS ; BASIC ELECTRIC ELEMENTS ; CABLES ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CASTING ; CHEMICAL PAINT OR INK REMOVERS ; CHEMISTRY ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; COMPOSITIONS BASED THEREON ; CONDUCTORS ; CORRECTING FLUIDS ; DYES ; ELECTRIC HEATING ; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FERROUS OR NON-FERROUS ALLOYS ; FILLING PASTES ; GENERAL PROCESSES OF COMPOUNDING ; INKS ; INSULATORS ; MAKING METALLIC POWDER ; MANUFACTURE OF ARTICLES FROM METALLIC POWDER ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; PERFORMING OPERATIONS ; POLISHES ; POWDER METALLURGY ; PRINTED CIRCUITS ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; TRANSPORTING ; TREATMENT OF ALLOYS OR NON-FERROUS METALS ; USE OF MATERIALS THEREFOR ; WOODSTAINS ; WORKING METALLIC POWDER ; WORKING-UP</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180309&DB=EPODOC&CC=CN&NR=107787258A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180309&DB=EPODOC&CC=CN&NR=107787258A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>BASHIR MUBASHER A</creatorcontrib><creatorcontrib>RENNY JOSEPH S</creatorcontrib><creatorcontrib>DE GRAAF MICHAEL A</creatorcontrib><creatorcontrib>CLARACQ JEROME</creatorcontrib><creatorcontrib>PROT STEFAN</creatorcontrib><title>Combined photo and chemical sintering of a nano-conductive particles deposition layer</title><description>The material properties of structures made with conductive nanoparticles are enhanced by radiation sintering followed by chemical sintering. The conductive nanoparticles may be applied to substrates by methods such as screen printing, inkjet, aerosol and electrospinning and then sintering the conductive nanoparticles on the substrates.
由导电的纳米粒子制备的结构的材料特性通过辐射烧结接着化学烧结增强。导电的纳米粒子可通过如丝网印刷、喷墨、气溶胶和电纺丝的方法涂覆到衬底，且随后烧结衬底上的导电的纳米粒子。</description><subject>ADHESIVES</subject><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>ALLOYS</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CASTING</subject><subject>CHEMICAL PAINT OR INK REMOVERS</subject><subject>CHEMISTRY</subject><subject>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>CONDUCTORS</subject><subject>CORRECTING FLUIDS</subject><subject>DYES</subject><subject>ELECTRIC HEATING</subject><subject>ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FERROUS OR NON-FERROUS ALLOYS</subject><subject>FILLING PASTES</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>INKS</subject><subject>INSULATORS</subject><subject>MAKING METALLIC POWDER</subject><subject>MANUFACTURE OF ARTICLES FROM METALLIC POWDER</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>PASTES OR SOLIDS FOR COLOURING OR PRINTING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHES</subject><subject>POWDER METALLURGY</subject><subject>PRINTED CIRCUITS</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>TRANSPORTING</subject><subject>TREATMENT OF ALLOYS OR NON-FERROUS METALS</subject><subject>USE OF MATERIALS THEREFOR</subject><subject>WOODSTAINS</subject><subject>WORKING METALLIC POWDER</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyjsKAjEQANA0FqLeYTzAgh8k20pQrKy0XsZkdncgOxOSKHh7LTyA1Wve3NydTg8WCpBGrQooAfxIE3uMUFgqZZYBtAcEQdHGq4Snr_wiSJgr-0gFAiUtXFkFIr4pL82sx1ho9XNh1ufTzV2a7-uoJPQkVDt33W6sbe3u0B73_5wP6Ks5gg</recordid><startdate>20180309</startdate><enddate>20180309</enddate><creator>BASHIR MUBASHER A</creator><creator>RENNY JOSEPH S</creator><creator>DE GRAAF MICHAEL A</creator><creator>CLARACQ JEROME</creator><creator>PROT STEFAN</creator><scope>EVB</scope></search><sort><creationdate>20180309</creationdate><title>Combined photo and chemical sintering of a nano-conductive particles deposition layer</title><author>BASHIR MUBASHER A ; RENNY JOSEPH S ; DE GRAAF MICHAEL A ; CLARACQ JEROME ; PROT STEFAN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN107787258A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2018</creationdate><topic>ADHESIVES</topic><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>ALLOYS</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CASTING</topic><topic>CHEMICAL PAINT OR INK REMOVERS</topic><topic>CHEMISTRY</topic><topic>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>CONDUCTORS</topic><topic>CORRECTING FLUIDS</topic><topic>DYES</topic><topic>ELECTRIC HEATING</topic><topic>ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FERROUS OR NON-FERROUS ALLOYS</topic><topic>FILLING PASTES</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>INKS</topic><topic>INSULATORS</topic><topic>MAKING METALLIC POWDER</topic><topic>MANUFACTURE OF ARTICLES FROM METALLIC POWDER</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>PASTES OR SOLIDS FOR COLOURING OR PRINTING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHES</topic><topic>POWDER METALLURGY</topic><topic>PRINTED CIRCUITS</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>TRANSPORTING</topic><topic>TREATMENT OF ALLOYS OR NON-FERROUS METALS</topic><topic>USE OF MATERIALS THEREFOR</topic><topic>WOODSTAINS</topic><topic>WORKING METALLIC POWDER</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>BASHIR MUBASHER A</creatorcontrib><creatorcontrib>RENNY JOSEPH S</creatorcontrib><creatorcontrib>DE GRAAF MICHAEL A</creatorcontrib><creatorcontrib>CLARACQ JEROME</creatorcontrib><creatorcontrib>PROT STEFAN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>BASHIR MUBASHER A</au><au>RENNY JOSEPH S</au><au>DE GRAAF MICHAEL A</au><au>CLARACQ JEROME</au><au>PROT STEFAN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Combined photo and chemical sintering of a nano-conductive particles deposition layer</title><date>2018-03-09</date><risdate>2018</risdate><abstract>The material properties of structures made with conductive nanoparticles are enhanced by radiation sintering followed by chemical sintering. The conductive nanoparticles may be applied to substrates by methods such as screen printing, inkjet, aerosol and electrospinning and then sintering the conductive nanoparticles on the substrates.
由导电的纳米粒子制备的结构的材料特性通过辐射烧结接着化学烧结增强。导电的纳米粒子可通过如丝网印刷、喷墨、气溶胶和电纺丝的方法涂覆到衬底，且随后烧结衬底上的导电的纳米粒子。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ALLOYS BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CASTING CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CONDUCTORS CORRECTING FLUIDS DYES ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS FILLING PASTES GENERAL PROCESSES OF COMPOUNDING INKS INSULATORS MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING PERFORMING OPERATIONS POLISHES POWDER METALLURGY PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS USE OF MATERIALS THEREFOR WOODSTAINS WORKING METALLIC POWDER WORKING-UP |
| title | Combined photo and chemical sintering of a nano-conductive particles deposition layer |
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