Circuit Board

Provided is a circuit board capable of dissipating heat at a higher efficiency compared with conventional cases from an electronic component mounted at a high density. A circuit board 2 has a first wiring layer 33 and a second wiring layer 34, which are laminated on the front surface 31a side of an...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	YOKOZAWA MITSUO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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