Test board for semiconductor package and test system

A test board includes: a board substrate; a device under test (DUT) socket connected to the board substrate and configured to accommodate a semiconductor package; a test controller; a wireless signalunit configured to wirelessly exchange signals with a server; and a wireless power unit configured to...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: JOO-SUNG YUN, SEONG-SEOB SHIN, WOON-SUP CHOI, MOON-HO LEE
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
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