SOLID STATE DRIVE PACKAGE

A solid state drive package is provided. The solid state drive package may include an integrated circuit substrate including: a lower redistribution layer; a first chip and a second chip provided on the lower redistribution layer; and a connection substrate provided on the lower redistribution layer, the connection substrate provided on an outer periphery of the first chip and the second chip; anda plurality of third chips provided on the integrated circuit substrate. The plurality of third chips are electrically connected to the first chip and the second chip via the connection substrate andthe lower redistribution layer. 提供了种固态驱动器封装。该固态驱动器封装可以包括集成电路基板和提供在集成电路基板上的多个第三芯片，集成电路基板包括：下再分布层；提供在下再分布层上的第芯片和第二芯片；以及提供在下再分布层上的连接基板，连接基板被提供在第芯片和第二芯片的外周上。所述多个第三芯片经由连接基板和下再分布层电连接到第芯片和第二芯片。