Novel PCB, processing technology and processing assembly line
The invention discloses a novel PCB, a processing technology and a processing assembly line. The novel PCB comprises a PCB main body, wherein a first preset position and a second preset position are arranged on the same side surface of the PCB main body; the first preset position is used for arrangi...
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| creator | LIAO GUOZHEN CAO JING |
| description | The invention discloses a novel PCB, a processing technology and a processing assembly line. The novel PCB comprises a PCB main body, wherein a first preset position and a second preset position are arranged on the same side surface of the PCB main body; the first preset position is used for arranging a rough surface; and the second preset position is used for arranging an electronic component. According to the novel PCB, the roughness of the PCB main body is improved, and the contact area of a plastic packaging body and the surface of the PCB is increased in the subsequent plastic packaging process, thereby improving the connection fastness, stability and tightness of the plastic packaging body and the PCB and ensuring the plastic packaging quality. Therefore, the hardware quality (such as, a drop test of a product and the insulating property of the electronic component) and the software quality (such as, the stability and intensity of a signal of the electronic component) of an electronic product with the P |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN107613649A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN107613649A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN107613649A3</originalsourceid><addsrcrecordid>eNrjZLD1yy9LzVEIcHbSUSgoyk9OLS7OzEtXKElNzsjLz8lPr1RIzEtBlkksLk7NTcqpVMjJzEvlYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxzn6GBuZmhsZmJpaOxsSoAQD54zAE</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Novel PCB, processing technology and processing assembly line</title><source>esp@cenet</source><creator>LIAO GUOZHEN ; CAO JING</creator><creatorcontrib>LIAO GUOZHEN ; CAO JING</creatorcontrib><description>The invention discloses a novel PCB, a processing technology and a processing assembly line. The novel PCB comprises a PCB main body, wherein a first preset position and a second preset position are arranged on the same side surface of the PCB main body; the first preset position is used for arranging a rough surface; and the second preset position is used for arranging an electronic component. According to the novel PCB, the roughness of the PCB main body is improved, and the contact area of a plastic packaging body and the surface of the PCB is increased in the subsequent plastic packaging process, thereby improving the connection fastness, stability and tightness of the plastic packaging body and the PCB and ensuring the plastic packaging quality. Therefore, the hardware quality (such as, a drop test of a product and the insulating property of the electronic component) and the software quality (such as, the stability and intensity of a signal of the electronic component) of an electronic product with the P</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180119&DB=EPODOC&CC=CN&NR=107613649A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180119&DB=EPODOC&CC=CN&NR=107613649A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIAO GUOZHEN</creatorcontrib><creatorcontrib>CAO JING</creatorcontrib><title>Novel PCB, processing technology and processing assembly line</title><description>The invention discloses a novel PCB, a processing technology and a processing assembly line. The novel PCB comprises a PCB main body, wherein a first preset position and a second preset position are arranged on the same side surface of the PCB main body; the first preset position is used for arranging a rough surface; and the second preset position is used for arranging an electronic component. According to the novel PCB, the roughness of the PCB main body is improved, and the contact area of a plastic packaging body and the surface of the PCB is increased in the subsequent plastic packaging process, thereby improving the connection fastness, stability and tightness of the plastic packaging body and the PCB and ensuring the plastic packaging quality. Therefore, the hardware quality (such as, a drop test of a product and the insulating property of the electronic component) and the software quality (such as, the stability and intensity of a signal of the electronic component) of an electronic product with the P</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLD1yy9LzVEIcHbSUSgoyk9OLS7OzEtXKElNzsjLz8lPr1RIzEtBlkksLk7NTcqpVMjJzEvlYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxzn6GBuZmhsZmJpaOxsSoAQD54zAE</recordid><startdate>20180119</startdate><enddate>20180119</enddate><creator>LIAO GUOZHEN</creator><creator>CAO JING</creator><scope>EVB</scope></search><sort><creationdate>20180119</creationdate><title>Novel PCB, processing technology and processing assembly line</title><author>LIAO GUOZHEN ; CAO JING</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN107613649A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2018</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>LIAO GUOZHEN</creatorcontrib><creatorcontrib>CAO JING</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIAO GUOZHEN</au><au>CAO JING</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Novel PCB, processing technology and processing assembly line</title><date>2018-01-19</date><risdate>2018</risdate><abstract>The invention discloses a novel PCB, a processing technology and a processing assembly line. The novel PCB comprises a PCB main body, wherein a first preset position and a second preset position are arranged on the same side surface of the PCB main body; the first preset position is used for arranging a rough surface; and the second preset position is used for arranging an electronic component. According to the novel PCB, the roughness of the PCB main body is improved, and the contact area of a plastic packaging body and the surface of the PCB is increased in the subsequent plastic packaging process, thereby improving the connection fastness, stability and tightness of the plastic packaging body and the PCB and ensuring the plastic packaging quality. Therefore, the hardware quality (such as, a drop test of a product and the insulating property of the electronic component) and the software quality (such as, the stability and intensity of a signal of the electronic component) of an electronic product with the P</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Novel PCB, processing technology and processing assembly line |
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