Surface mounting structure, surface mounting method, motor and surface mounting chip
The invention discloses a surface mounting structure, a surface mounting method, a motor and a surface mounting chip to decrease the thickness of a printed circuit board, reduce the production cost ofthe printed circuit board, simplify the manufacturing process of the printed circuit board and prolo...
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| creator | LIANG SAICHANG |
| description | The invention discloses a surface mounting structure, a surface mounting method, a motor and a surface mounting chip to decrease the thickness of a printed circuit board, reduce the production cost ofthe printed circuit board, simplify the manufacturing process of the printed circuit board and prolong the service life of the printed circuit board. The surface mounting structure comprises the printed circuit board and a sensor chip, the printed circuit board is provided with a dug hole, a circuit layer is arranged on a first surface of the printed circuit board, the sensor chip comprises a chip body and a pin, a sensor element is packaged in the chip body, the pin is led out of the chip body, the chip body is positioned in the dug hole, the sensor element faces a second surface of the printed circuit board, and the pin is connected with the circuit layer.
本发明公开了种表面贴装结构、表面贴装方法、电机及表面贴装芯片，以减小印刷电路板的厚度，降低其生产成本，简化其制作工艺，并延长其使用寿命。表面贴装结构包括：印刷电路板，具有挖孔，印刷电路板的第面设置有线路层；传感器芯片，包括封装有传感器元件的芯片本体，以及从芯片本体引出的引脚，芯片本体位于挖孔内，传感器元件朝向印刷 |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN107612226A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN107612226A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN107612226A3</originalsourceid><addsrcrecordid>eNrjZAgJLi1KS0xOVcjNL80rycxLVyguKSpNLiktStVRKEaXy00tychP0QEKlOQXKSTmpWAqSc7ILOBhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBUANeakl8c5-hgbmZoZGRkZmjsbEqAEA3BU5MQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Surface mounting structure, surface mounting method, motor and surface mounting chip</title><source>esp@cenet</source><creator>LIANG SAICHANG</creator><creatorcontrib>LIANG SAICHANG</creatorcontrib><description>The invention discloses a surface mounting structure, a surface mounting method, a motor and a surface mounting chip to decrease the thickness of a printed circuit board, reduce the production cost ofthe printed circuit board, simplify the manufacturing process of the printed circuit board and prolong the service life of the printed circuit board. The surface mounting structure comprises the printed circuit board and a sensor chip, the printed circuit board is provided with a dug hole, a circuit layer is arranged on a first surface of the printed circuit board, the sensor chip comprises a chip body and a pin, a sensor element is packaged in the chip body, the pin is led out of the chip body, the chip body is positioned in the dug hole, the sensor element faces a second surface of the printed circuit board, and the pin is connected with the circuit layer.
本发明公开了种表面贴装结构、表面贴装方法、电机及表面贴装芯片，以减小印刷电路板的厚度，降低其生产成本，简化其制作工艺，并延长其使用寿命。表面贴装结构包括：印刷电路板，具有挖孔，印刷电路板的第面设置有线路层；传感器芯片，包括封装有传感器元件的芯片本体，以及从芯片本体引出的引脚，芯片本体位于挖孔内，传感器元件朝向印刷</description><language>chi ; eng</language><subject>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ; DYNAMO-ELECTRIC MACHINES ; ELECTRICITY ; GENERATION</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180119&DB=EPODOC&CC=CN&NR=107612226A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180119&DB=EPODOC&CC=CN&NR=107612226A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIANG SAICHANG</creatorcontrib><title>Surface mounting structure, surface mounting method, motor and surface mounting chip</title><description>The invention discloses a surface mounting structure, a surface mounting method, a motor and a surface mounting chip to decrease the thickness of a printed circuit board, reduce the production cost ofthe printed circuit board, simplify the manufacturing process of the printed circuit board and prolong the service life of the printed circuit board. The surface mounting structure comprises the printed circuit board and a sensor chip, the printed circuit board is provided with a dug hole, a circuit layer is arranged on a first surface of the printed circuit board, the sensor chip comprises a chip body and a pin, a sensor element is packaged in the chip body, the pin is led out of the chip body, the chip body is positioned in the dug hole, the sensor element faces a second surface of the printed circuit board, and the pin is connected with the circuit layer.
本发明公开了种表面贴装结构、表面贴装方法、电机及表面贴装芯片，以减小印刷电路板的厚度，降低其生产成本，简化其制作工艺，并延长其使用寿命。表面贴装结构包括：印刷电路板，具有挖孔，印刷电路板的第面设置有线路层；传感器芯片，包括封装有传感器元件的芯片本体，以及从芯片本体引出的引脚，芯片本体位于挖孔内，传感器元件朝向印刷</description><subject>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER</subject><subject>DYNAMO-ELECTRIC MACHINES</subject><subject>ELECTRICITY</subject><subject>GENERATION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAgJLi1KS0xOVcjNL80rycxLVyguKSpNLiktStVRKEaXy00tychP0QEKlOQXKSTmpWAqSc7ILOBhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBUANeakl8c5-hgbmZoZGRkZmjsbEqAEA3BU5MQ</recordid><startdate>20180119</startdate><enddate>20180119</enddate><creator>LIANG SAICHANG</creator><scope>EVB</scope></search><sort><creationdate>20180119</creationdate><title>Surface mounting structure, surface mounting method, motor and surface mounting chip</title><author>LIANG SAICHANG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN107612226A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2018</creationdate><topic>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER</topic><topic>DYNAMO-ELECTRIC MACHINES</topic><topic>ELECTRICITY</topic><topic>GENERATION</topic><toplevel>online_resources</toplevel><creatorcontrib>LIANG SAICHANG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIANG SAICHANG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Surface mounting structure, surface mounting method, motor and surface mounting chip</title><date>2018-01-19</date><risdate>2018</risdate><abstract>The invention discloses a surface mounting structure, a surface mounting method, a motor and a surface mounting chip to decrease the thickness of a printed circuit board, reduce the production cost ofthe printed circuit board, simplify the manufacturing process of the printed circuit board and prolong the service life of the printed circuit board. The surface mounting structure comprises the printed circuit board and a sensor chip, the printed circuit board is provided with a dug hole, a circuit layer is arranged on a first surface of the printed circuit board, the sensor chip comprises a chip body and a pin, a sensor element is packaged in the chip body, the pin is led out of the chip body, the chip body is positioned in the dug hole, the sensor element faces a second surface of the printed circuit board, and the pin is connected with the circuit layer.
本发明公开了种表面贴装结构、表面贴装方法、电机及表面贴装芯片，以减小印刷电路板的厚度，降低其生产成本，简化其制作工艺，并延长其使用寿命。表面贴装结构包括：印刷电路板，具有挖孔，印刷电路板的第面设置有线路层；传感器芯片，包括封装有传感器元件的芯片本体，以及从芯片本体引出的引脚，芯片本体位于挖孔内，传感器元件朝向印刷</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | CONVERSION OR DISTRIBUTION OF ELECTRIC POWER DYNAMO-ELECTRIC MACHINES ELECTRICITY GENERATION |
| title | Surface mounting structure, surface mounting method, motor and surface mounting chip |
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