Manufacturing method of circuit board

The invention discloses a manufacturing method of a circuit board. The method comprises following steps of forming first metal circuits on a substrate; forming insulation layer with openings on the first metal circuit and the substrate, wherein parts of the first metal circuits are exposed through the openings; and forming second metal circuits on the insulation layers so as to allow the second metal circuits to connect the exposed first metal circuits. 本发明公开了种电路板的制作方法，包括以下步骤：形成第金属线路于基板上；形成具有开口的绝缘层于该第金属线路及该基板上，其中该开口露出部分该第金属线路；以及形成第二金属线路于该绝缘层上，使得该第二金属线路连接该露出部分的该第金属线路。