Tail end gas path sealing device applied to tail end overturning wafer robot
The invention discloses a tail end gas path sealing device applied to a tail end overturning wafer robot. A robot tail end is overturned through a motor synchronous belt. A sealing assembly tail end connecting flange is connected with an overturning gripper. A fixed pipe is connected with a gas path...
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| creator | LIU ZHIFENG CHENG JIANGLI LI FENGYANG XU BO QI ZEHUA YANG CONGBIN |
| description | The invention discloses a tail end gas path sealing device applied to a tail end overturning wafer robot. A robot tail end is overturned through a motor synchronous belt. A sealing assembly tail end connecting flange is connected with an overturning gripper. A fixed pipe is connected with a gas path at the front end and fixed into a tail end shell through a flange. In the sealing process during wafer adsorption, a gas valve generates the negative pressure in a gas path, a cleaning chamber is in positive pressure relative to the gas path, at the time, an outer ring of a rubber sealing ring is pressed on the fixed pipe due to the inner and outer gas pressure difference, and accordingly a wafer can be adsorbed and grabbed through the gas path seal. Due to the fact that the seal is conducted through the inner and outer gas pressure difference, the gas path seal effect is completely not influenced during overturning action conducting. According to the gas path scheme, line twisting is avoided, the coaxial design o |
| format | Patent |
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A robot tail end is overturned through a motor synchronous belt. A sealing assembly tail end connecting flange is connected with an overturning gripper. A fixed pipe is connected with a gas path at the front end and fixed into a tail end shell through a flange. In the sealing process during wafer adsorption, a gas valve generates the negative pressure in a gas path, a cleaning chamber is in positive pressure relative to the gas path, at the time, an outer ring of a rubber sealing ring is pressed on the fixed pipe due to the inner and outer gas pressure difference, and accordingly a wafer can be adsorbed and grabbed through the gas path seal. Due to the fact that the seal is conducted through the inner and outer gas pressure difference, the gas path seal effect is completely not influenced during overturning action conducting. 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| language | chi ; eng |
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| subjects | BLASTING CHAMBERS PROVIDED WITH MANIPULATION DEVICES CYLINDERS ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS HAND TOOLS HEATING LIGHTING MANIPULATORS MECHANICAL ENGINEERING PERFORMING OPERATIONS PISTONS PORTABLE POWER-DRIVEN TOOLS SEALINGS THERMAL INSULATION IN GENERAL TRANSPORTING WEAPONS |
| title | Tail end gas path sealing device applied to tail end overturning wafer robot |
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