ELECTRONIC DEVICE WITH STACKED ELECTRONIC CHIPS

ELECTRONIC DEVICE WITH STACKED ELECTRONIC CHIPS

The invention relates to an electronic equipment specifically has the electronic equipment who piles up the electron chip for one kind, contains: carrier base plate (2), at least first electron chip (4) and second chip (15), wherein install on carrier base plate (2) first chip (4), is connected the...

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1. Verfasser: SAUGIER ERIC
Format: Patent
Sprache:chi ; eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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description The invention relates to an electronic equipment specifically has the electronic equipment who piles up the electron chip for one kind, contains: carrier base plate (2), at least first electron chip (4) and second chip (15), wherein install on carrier base plate (2) first chip (4), is connected the front of first chip electric linked network (8) and electric linked network (3) of carrier base plate via male electrical connecting element (14), install on first chip second chip (15), is connected the front of second chip electric linked network (19) back electricity linked network (11) with first chip via male electrical connecting element (21), and the electric linked network in the back of first chip and the electric linked network of carrier base plate are connected in electric connecting wire (22). 本公开涉及种具有堆叠电子芯片的电子设备，包含：载体基板(2)；至少第电子芯片(4)和第二芯片(15)；其中第芯片(4)安装在载体基板(2)上，经由插入的电连接元件(14)将第芯片的正面电连接网络(8)与载体基板的电连接网络(3)进行连接；第二芯片(15)安装在第芯片上，经由插入的电连接元件(21)将第二芯片的正面电连接网络(19)与第芯片的背面电连接网络(11)进行连接；并且电连接线(22)将第芯片的背面电连接网络与载体
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eng</language><creationdate>2017</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>SAUGIER ERIC</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SAUGIER ERIC</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ELECTRONIC DEVICE WITH STACKED ELECTRONIC CHIPS</title><date>2017-12-05</date><risdate>2017</risdate><abstract>The invention relates to an electronic equipment specifically has the electronic equipment who piles up the electron chip for one kind, contains: carrier base plate (2), at least first electron chip (4) and second chip (15), wherein install on carrier base plate (2) first chip (4), is connected the front of first chip electric linked network (8) and electric linked network (3) of carrier base plate via male electrical connecting element (14), install on first chip second chip (15), is connected the front of second chip electric linked network (19) back electricity linked network (11) with first chip via male electrical connecting element (21), and the electric linked network in the back of first chip and the electric linked network of carrier base plate are connected in electric connecting wire (22). 本公开涉及种具有堆叠电子芯片的电子设备，包含：载体基板(2)；至少第电子芯片(4)和第二芯片(15)；其中第芯片(4)安装在载体基板(2)上，经由插入的电连接元件(14)将第芯片的正面电连接网络(8)与载体基板的电连接网络(3)进行连接；第二芯片(15)安装在第芯片上，经由插入的电连接元件(21)将第二芯片的正面电连接网络(19)与第芯片的背面电连接网络(11)进行连接；并且电连接线(22)将第芯片的背面电连接网络与载体</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title ELECTRONIC DEVICE WITH STACKED ELECTRONIC CHIPS
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