Thin-film circuit electromagnetic shielding packaging method
The invention provides a thin-film circuit electromagnetic shielding packaging method. The method concretely comprises the steps that step one, the front surface of a substrate completing array arrangement circuit manufacturing is adhered on a high temperature adhesive tape; step two, the solder is...
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| creator | QIN YUELI WANG CHUNFU LI YANRUI ZHOU JUN WANG WENBO |
| description | The invention provides a thin-film circuit electromagnetic shielding packaging method. The method concretely comprises the steps that step one, the front surface of a substrate completing array arrangement circuit manufacturing is adhered on a high temperature adhesive tape; step two, the solder is covered on the back surface and the side surface of a circuit wafer; step three, the high temperature adhesive tape is removed; step four, a metal seal cover having the corresponding size with that of each circuit sub-wafer is selected, and the metal seal cover is downwardly folded and sealed to be embedded in the through cavity of the substrate so that the sealed external edge is enabled to be aligned with the bottom part of the circuit wafer and the internal wall is enabled to be closely fit with the circuit; and step five, the clamped array structure is overturned so that the bottom solder is enabled to be upward and fixed, and batch soldering and packaging of the metal seal cover and the thin-film circuit wafer |
| format | Patent |
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The method concretely comprises the steps that step one, the front surface of a substrate completing array arrangement circuit manufacturing is adhered on a high temperature adhesive tape; step two, the solder is covered on the back surface and the side surface of a circuit wafer; step three, the high temperature adhesive tape is removed; step four, a metal seal cover having the corresponding size with that of each circuit sub-wafer is selected, and the metal seal cover is downwardly folded and sealed to be embedded in the through cavity of the substrate so that the sealed external edge is enabled to be aligned with the bottom part of the circuit wafer and the internal wall is enabled to be closely fit with the circuit; and step five, the clamped array structure is overturned so that the bottom solder is enabled to be upward and fixed, and batch soldering and packaging of the metal seal cover and the thin-film circuit wafer</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20171020&DB=EPODOC&CC=CN&NR=107278025A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25555,76308</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20171020&DB=EPODOC&CC=CN&NR=107278025A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>QIN YUELI</creatorcontrib><creatorcontrib>WANG CHUNFU</creatorcontrib><creatorcontrib>LI YANRUI</creatorcontrib><creatorcontrib>ZHOU JUN</creatorcontrib><creatorcontrib>WANG WENBO</creatorcontrib><title>Thin-film circuit electromagnetic shielding packaging method</title><description>The invention provides a thin-film circuit electromagnetic shielding packaging method. 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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Thin-film circuit electromagnetic shielding packaging method |
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