Electroplating device for wafer

The invention provides an electroplating device for a wafer, which can carry out relatively equipollent electroplating treatment on the whole surface of an electroplating object surface of the wafer, and can reliably and equaly apply electroplating treatment on the electroplating object surface with...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	SAKAKI YASUHIKO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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