Electroplating device for wafer

The invention provides an electroplating device for a wafer, which can carry out relatively equipollent electroplating treatment on the whole surface of an electroplating object surface of the wafer, and can reliably and equaly apply electroplating treatment on the electroplating object surface with relatively wide area. The interior of an electroplating tank (10) is provided with a stirring rod (41); by moving the stirring rod (41), electroplating solution near to the electroplating object surface of the wafer (W) is stirred, and electroplating treatment to the electroplating object surface is simultaneously carried out, so that the stirring rod (41) swings in a motion surface which is appropriately parallel to the electroplating object surface of the wafer (W) and rotates simultaneously; and therefore, vortex flow is produced by inhibiting the electroplating solutions during stirring, and the relatively equipollent electroplating treatment can be reliably applied in the relatively wide range. 本发明提供种晶片的电镀装置，