Roughened copper foil, copper clad laminate, and printed circuit board
Provided is a roughened copper foil for which adhesion to an insulating resin and reliability (for example, heat resistance after moisture absorption) can be significantly improved. This roughened copper foil has a roughened surface with microprotrusions and recesses configured from needle-like crys...
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| creator | TSUYOSHI HIROAKI MOGI SATOSHI |
| description | Provided is a roughened copper foil for which adhesion to an insulating resin and reliability (for example, heat resistance after moisture absorption) can be significantly improved. This roughened copper foil has a roughened surface with microprotrusions and recesses configured from needle-like crystals on at least one side and the surface of the needle-like crystals overall comprises a mixed phase of Cu metal and Cu2O.
本发明提供能够显著地提高与绝缘树脂的密合性和可靠性(例如吸湿耐热性)的粗糙化处理铜箔。本发明的粗糙化处理铜箔在至少侧具有具备由针状结晶构成的微细凹凸的粗糙化处理面，针状结晶的表面全部由Cu金属和CuO的混相构成。 |
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本发明提供能够显著地提高与绝缘树脂的密合性和可靠性(例如吸湿耐热性)的粗糙化处理铜箔。本发明的粗糙化处理铜箔在至少侧具有具备由针状结晶构成的微细凹凸的粗糙化处理面，针状结晶的表面全部由Cu金属和CuO的混相构成。</description><language>chi ; eng</language><subject>APPARATUS THEREFOR ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION ; TRANSPORTING</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170801&DB=EPODOC&CC=CN&NR=107002249A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25555,76308</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170801&DB=EPODOC&CC=CN&NR=107002249A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TSUYOSHI HIROAKI</creatorcontrib><creatorcontrib>MOGI SATOSHI</creatorcontrib><title>Roughened copper foil, copper clad laminate, and printed circuit board</title><description>Provided is a roughened copper foil for which adhesion to an insulating resin and reliability (for example, heat resistance after moisture absorption) can be significantly improved. This roughened copper foil has a roughened surface with microprotrusions and recesses configured from needle-like crystals on at least one side and the surface of the needle-like crystals overall comprises a mixed phase of Cu metal and Cu2O.
本发明提供能够显著地提高与绝缘树脂的密合性和可靠性(例如吸湿耐热性)的粗糙化处理铜箔。本发明的粗糙化处理铜箔在至少侧具有具备由针状结晶构成的微细凹凸的粗糙化处理面，针状结晶的表面全部由Cu金属和CuO的混相构成。</description><subject>APPARATUS THEREFOR</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHALyi9Nz0jNS01RSM4vKEgtUkjLz8zRgXGScxJTFHISczPzEktSdRQS81IUCooy80pAyjOLkkszSxSS8hOLUngYWNMSc4pTeaE0N4Oim2uIs4duakF-fGpxQWIy0IqSeGc_QwNzAwMjIxNLR2Ni1AAA62gy9w</recordid><startdate>20170801</startdate><enddate>20170801</enddate><creator>TSUYOSHI HIROAKI</creator><creator>MOGI SATOSHI</creator><scope>EVB</scope></search><sort><creationdate>20170801</creationdate><title>Roughened copper foil, copper clad laminate, and printed circuit board</title><author>TSUYOSHI HIROAKI ; MOGI SATOSHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN107002249A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2017</creationdate><topic>APPARATUS THEREFOR</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>TSUYOSHI HIROAKI</creatorcontrib><creatorcontrib>MOGI SATOSHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TSUYOSHI HIROAKI</au><au>MOGI SATOSHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Roughened copper foil, copper clad laminate, and printed circuit board</title><date>2017-08-01</date><risdate>2017</risdate><abstract>Provided is a roughened copper foil for which adhesion to an insulating resin and reliability (for example, heat resistance after moisture absorption) can be significantly improved. This roughened copper foil has a roughened surface with microprotrusions and recesses configured from needle-like crystals on at least one side and the surface of the needle-like crystals overall comprises a mixed phase of Cu metal and Cu2O.
本发明提供能够显著地提高与绝缘树脂的密合性和可靠性(例如吸湿耐热性)的粗糙化处理铜箔。本发明的粗糙化处理铜箔在至少侧具有具备由针状结晶构成的微细凹凸的粗糙化处理面，针状结晶的表面全部由Cu金属和CuO的混相构成。</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN107002249A |
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| subjects | APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING |
| title | Roughened copper foil, copper clad laminate, and printed circuit board |
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