Cooling element for electronic components and electronic device

A cooling element comprising a cooling body, the cooling body comprising a first surface and a second surface, the first surface and the second surface being on the opposing sides of the body and the distance between the first and second surfaces defining the height of the cooling body, multiple of...

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Hauptverfasser: VILJASALO, JUHA, BJORKMAN, NIKO, SEVAKIVI, PERTTI
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Sprache:chi ; eng
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creator VILJASALO, JUHA
BJORKMAN, NIKO
SEVAKIVI, PERTTI
description A cooling element comprising a cooling body, the cooling body comprising a first surface and a second surface, the first surface and the second surface being on the opposing sides of the body and the distance between the first and second surfaces defining the height of the cooling body, multiple of channels for cooling liquid arranged inside the cooling body, the channels extending in a longitudinal direction of the cooling body, wherein the channels are arranged in two layers in the direction of the height of the cooling body inside the cooling body and the cooling element is adapted to hold electronic components on the first surface and on the second surface for cooling electronic components on both surfaces. 提供种冷却元件,所述冷却元件包括冷却本体,所述冷却本体包括第表面和第二表面,所述第表面和所述第二表面位于所述冷却本体的相反两侧上,并且,所述第表面和所述第二表面之间的距离限定所述冷却本体的高度,在所述冷却本体内设置有用于冷却液的多个通道,所述通道在所述冷却本体的纵向方向上延伸,其中,所述通道在所述冷却本体内且在所述冷却本体的所述高度的方向上分两层布置,并且,所述冷却元件适于在所述第表面上和所述第二表面上保持电子部件以便冷却两个表面上的电子部件。
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Cooling element for electronic components and electronic device
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