Wire-bonding device and wire-bonding method

The invention relates to a wire-bonding device and a wire-bonding method. The wire bonding device comprises a wire transmission device for transmitting a bonding wire, a weldment for connecting the wire transmission device, and a cleaner disposed between the wire transmission device and the weldment...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHU, YUDE, YEH, MENG HUNG, CHIANG, LIENN, LIN, WEI-SHENG, CHEN, HSIN-LONG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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