Wire-bonding device and wire-bonding method
The invention relates to a wire-bonding device and a wire-bonding method. The wire bonding device comprises a wire transmission device for transmitting a bonding wire, a weldment for connecting the wire transmission device, and a cleaner disposed between the wire transmission device and the weldment...
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| creator | CHU, YUDE YEH, MENG HUNG CHIANG, LIENN LIN, WEI-SHENG CHEN, HSIN-LONG |
| description | The invention relates to a wire-bonding device and a wire-bonding method. The wire bonding device comprises a wire transmission device for transmitting a bonding wire, a weldment for connecting the wire transmission device, and a cleaner disposed between the wire transmission device and the weldment to clean the bonding wire from the wire transmission device, so that the weldment outputs the bonding wire through cleaning of the cleaner.
种打线装置及打线方法，其中该打线装置包括：用以输送焊线的输线器、连结该输线器的焊件、以及设于该输线器与该焊件之间的清理器，以通过该清理器清理来自该输线器的焊线，使该焊件输出经由该清理器清理后的焊线。 |
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种打线装置及打线方法，其中该打线装置包括：用以输送焊线的输线器、连结该输线器的焊件、以及设于该输线器与该焊件之间的清理器，以通过该清理器清理来自该输线器的焊线，使该焊件输出经由该清理器清理后的焊线。</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170707&DB=EPODOC&CC=CN&NR=106935521A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170707&DB=EPODOC&CC=CN&NR=106935521A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHU, YUDE</creatorcontrib><creatorcontrib>YEH, MENG HUNG</creatorcontrib><creatorcontrib>CHIANG, LIENN</creatorcontrib><creatorcontrib>LIN, WEI-SHENG</creatorcontrib><creatorcontrib>CHEN, HSIN-LONG</creatorcontrib><title>Wire-bonding device and wire-bonding method</title><description>The invention relates to a wire-bonding device and a wire-bonding method. The wire bonding device comprises a wire transmission device for transmitting a bonding wire, a weldment for connecting the wire transmission device, and a cleaner disposed between the wire transmission device and the weldment to clean the bonding wire from the wire transmission device, so that the weldment outputs the bonding wire through cleaning of the cleaner.
种打线装置及打线方法，其中该打线装置包括：用以输送焊线的输线器、连结该输线器的焊件、以及设于该输线器与该焊件之间的清理器，以通过该清理器清理来自该输线器的焊线，使该焊件输出经由该清理器清理后的焊线。</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAOzyxK1U3Kz0vJzEtXSEkty0xOVUjMS1EoRxbPTS3JyE_hYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxzn6GBmaWxqamRoaOxsSoAQBCKCkg</recordid><startdate>20170707</startdate><enddate>20170707</enddate><creator>CHU, YUDE</creator><creator>YEH, MENG HUNG</creator><creator>CHIANG, LIENN</creator><creator>LIN, WEI-SHENG</creator><creator>CHEN, HSIN-LONG</creator><scope>EVB</scope></search><sort><creationdate>20170707</creationdate><title>Wire-bonding device and wire-bonding method</title><author>CHU, YUDE ; YEH, MENG HUNG ; CHIANG, LIENN ; LIN, WEI-SHENG ; CHEN, HSIN-LONG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN106935521A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2017</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>CHU, YUDE</creatorcontrib><creatorcontrib>YEH, MENG HUNG</creatorcontrib><creatorcontrib>CHIANG, LIENN</creatorcontrib><creatorcontrib>LIN, WEI-SHENG</creatorcontrib><creatorcontrib>CHEN, HSIN-LONG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHU, YUDE</au><au>YEH, MENG HUNG</au><au>CHIANG, LIENN</au><au>LIN, WEI-SHENG</au><au>CHEN, HSIN-LONG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Wire-bonding device and wire-bonding method</title><date>2017-07-07</date><risdate>2017</risdate><abstract>The invention relates to a wire-bonding device and a wire-bonding method. The wire bonding device comprises a wire transmission device for transmitting a bonding wire, a weldment for connecting the wire transmission device, and a cleaner disposed between the wire transmission device and the weldment to clean the bonding wire from the wire transmission device, so that the weldment outputs the bonding wire through cleaning of the cleaner.
种打线装置及打线方法，其中该打线装置包括：用以输送焊线的输线器、连结该输线器的焊件、以及设于该输线器与该焊件之间的清理器，以通过该清理器清理来自该输线器的焊线，使该焊件输出经由该清理器清理后的焊线。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Wire-bonding device and wire-bonding method |
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