Sensing chip

The present invention discloses a sensing chip, which comprises a substrate, a plurality of metal nanometer structures, a first surface modification layer and a second surface modification layer, wherein the metal nanometer structures are positioned on the substrate, the first surface modification l...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHEN PINCHENG, GAO FENGSHENG, SHI TINGYU, ZHU RENYOU, LIN DINGZHENG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MANUFACTURE OR TREATMENT OF NANOSTRUCTURES MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES MEASURING NANOTECHNOLOGY PERFORMING OPERATIONS PHYSICS SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES TESTING TRANSPORTING
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