Sensing chip
The present invention discloses a sensing chip, which comprises a substrate, a plurality of metal nanometer structures, a first surface modification layer and a second surface modification layer, wherein the metal nanometer structures are positioned on the substrate, the first surface modification l...
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| creator | CHEN PINCHENG GAO FENGSHENG SHI TINGYU ZHU RENYOU LIN DINGZHENG |
| description | The present invention discloses a sensing chip, which comprises a substrate, a plurality of metal nanometer structures, a first surface modification layer and a second surface modification layer, wherein the metal nanometer structures are positioned on the substrate, the first surface modification layer is positioned on the surface of the metal nanometer structure, the first surface modification layer comprises a plurality of molecules having a thiol group, and the second surface modification layer is positioned on the surface of the substrate and comprises a plurality of molecules having a silyl group. The sensing chip of the present invention has high sensitivity, and has high linearity for the concentration of molecules to be measured.
本发明公开种感测芯片，其包括基板、多个金属纳米结构、第表面修饰层以及第二表面修饰层。金属纳米结构位于基板上。第表面修饰层位于金属纳米结构的表面上，其中第表面修饰层包括多个具有硫醇基的分子。第二表面修饰层位于基板的表面上，第二表面修饰层包括多个具有硅烷基的分子。本发明的感测芯片具有高灵敏度以及对于待测分子的浓度具有高线性度。 |
| format | Patent |
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本发明公开种感测芯片，其包括基板、多个金属纳米结构、第表面修饰层以及第二表面修饰层。金属纳米结构位于基板上。第表面修饰层位于金属纳米结构的表面上，其中第表面修饰层包括多个具有硫醇基的分子。第二表面修饰层位于基板的表面上，第二表面修饰层包括多个具有硅烷基的分子。本发明的感测芯片具有高灵敏度以及对于待测分子的浓度具有高线性度。</description><language>chi ; eng</language><subject>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES ; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES ; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES ; MEASURING ; NANOTECHNOLOGY ; PERFORMING OPERATIONS ; PHYSICS ; SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES ; TESTING ; TRANSPORTING</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170704&DB=EPODOC&CC=CN&NR=106918578A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170704&DB=EPODOC&CC=CN&NR=106918578A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHEN PINCHENG</creatorcontrib><creatorcontrib>GAO FENGSHENG</creatorcontrib><creatorcontrib>SHI TINGYU</creatorcontrib><creatorcontrib>ZHU RENYOU</creatorcontrib><creatorcontrib>LIN DINGZHENG</creatorcontrib><title>Sensing chip</title><description>The present invention discloses a sensing chip, which comprises a substrate, a plurality of metal nanometer structures, a first surface modification layer and a second surface modification layer, wherein the metal nanometer structures are positioned on the substrate, the first surface modification layer is positioned on the surface of the metal nanometer structure, the first surface modification layer comprises a plurality of molecules having a thiol group, and the second surface modification layer is positioned on the surface of the substrate and comprises a plurality of molecules having a silyl group. The sensing chip of the present invention has high sensitivity, and has high linearity for the concentration of molecules to be measured.
本发明公开种感测芯片，其包括基板、多个金属纳米结构、第表面修饰层以及第二表面修饰层。金属纳米结构位于基板上。第表面修饰层位于金属纳米结构的表面上，其中第表面修饰层包括多个具有硫醇基的分子。第二表面修饰层位于基板的表面上，第二表面修饰层包括多个具有硅烷基的分子。本发明的感测芯片具有高灵敏度以及对于待测分子的浓度具有高线性度。</description><subject>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</subject><subject>MANUFACTURE OR TREATMENT OF NANOSTRUCTURES</subject><subject>MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES</subject><subject>MEASURING</subject><subject>NANOTECHNOLOGY</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICS</subject><subject>SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES</subject><subject>TESTING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOAJTs0rzsxLV0jOyCzgYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxzn6GBmaWhham5haOxsSoAQABdB2o</recordid><startdate>20170704</startdate><enddate>20170704</enddate><creator>CHEN PINCHENG</creator><creator>GAO FENGSHENG</creator><creator>SHI TINGYU</creator><creator>ZHU RENYOU</creator><creator>LIN DINGZHENG</creator><scope>EVB</scope></search><sort><creationdate>20170704</creationdate><title>Sensing chip</title><author>CHEN PINCHENG ; GAO FENGSHENG ; SHI TINGYU ; ZHU RENYOU ; LIN DINGZHENG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN106918578A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2017</creationdate><topic>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</topic><topic>MANUFACTURE OR TREATMENT OF NANOSTRUCTURES</topic><topic>MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES</topic><topic>MEASURING</topic><topic>NANOTECHNOLOGY</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICS</topic><topic>SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES</topic><topic>TESTING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>CHEN PINCHENG</creatorcontrib><creatorcontrib>GAO FENGSHENG</creatorcontrib><creatorcontrib>SHI TINGYU</creatorcontrib><creatorcontrib>ZHU RENYOU</creatorcontrib><creatorcontrib>LIN DINGZHENG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHEN PINCHENG</au><au>GAO FENGSHENG</au><au>SHI TINGYU</au><au>ZHU RENYOU</au><au>LIN DINGZHENG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Sensing chip</title><date>2017-07-04</date><risdate>2017</risdate><abstract>The present invention discloses a sensing chip, which comprises a substrate, a plurality of metal nanometer structures, a first surface modification layer and a second surface modification layer, wherein the metal nanometer structures are positioned on the substrate, the first surface modification layer is positioned on the surface of the metal nanometer structure, the first surface modification layer comprises a plurality of molecules having a thiol group, and the second surface modification layer is positioned on the surface of the substrate and comprises a plurality of molecules having a silyl group. The sensing chip of the present invention has high sensitivity, and has high linearity for the concentration of molecules to be measured.
本发明公开种感测芯片，其包括基板、多个金属纳米结构、第表面修饰层以及第二表面修饰层。金属纳米结构位于基板上。第表面修饰层位于金属纳米结构的表面上，其中第表面修饰层包括多个具有硫醇基的分子。第二表面修饰层位于基板的表面上，第二表面修饰层包括多个具有硅烷基的分子。本发明的感测芯片具有高灵敏度以及对于待测分子的浓度具有高线性度。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MANUFACTURE OR TREATMENT OF NANOSTRUCTURES MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES MEASURING NANOTECHNOLOGY PERFORMING OPERATIONS PHYSICS SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES TESTING TRANSPORTING |
| title | Sensing chip |
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