TFT substrate vapor deposition method
The invention provides a TFT substrate vapor deposition method. The TFT substrate vapor deposition method comprises depositing a first isolation material on a glass substrate, etching the first isolation material selectively, and forming several first openings which are arranged in an array in the f...
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creator | LIU XIAOJIA XI WANGFENG WENG JIAFENG DENG LIANG |
description | The invention provides a TFT substrate vapor deposition method. The TFT substrate vapor deposition method comprises depositing a first isolation material on a glass substrate, etching the first isolation material selectively, and forming several first openings which are arranged in an array in the first isolation material with the first openings being exposed in the surface of the glass substrate; arranging a metal line on the glass substrate with the metal line at least covering the bottom wall and the sidewall of each first opening; filling each first opening with a luminescent material; depositing a second isolation material on the TFT substrate, etching the second isolation material selectively, forming several second openings which are arranged in an array in the second isolation material with the second openings being exposed in the surface of the TFT substrate; arranging the glass substrate and the TFT substrate in an opposite manner, aligning the first openings to the second openings, providing voltag |
format | Patent |
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The TFT substrate vapor deposition method comprises depositing a first isolation material on a glass substrate, etching the first isolation material selectively, and forming several first openings which are arranged in an array in the first isolation material with the first openings being exposed in the surface of the glass substrate; arranging a metal line on the glass substrate with the metal line at least covering the bottom wall and the sidewall of each first opening; filling each first opening with a luminescent material; depositing a second isolation material on the TFT substrate, etching the second isolation material selectively, forming several second openings which are arranged in an array in the second isolation material with the second openings being exposed in the surface of the TFT substrate; arranging the glass substrate and the TFT substrate in an opposite manner, aligning the first openings to the second openings, providing voltag</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170630&DB=EPODOC&CC=CN&NR=106910844A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170630&DB=EPODOC&CC=CN&NR=106910844A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIU XIAOJIA</creatorcontrib><creatorcontrib>XI WANGFENG</creatorcontrib><creatorcontrib>WENG JIAFENG</creatorcontrib><creatorcontrib>DENG LIANG</creatorcontrib><title>TFT substrate vapor deposition method</title><description>The invention provides a TFT substrate vapor deposition method. 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The TFT substrate vapor deposition method comprises depositing a first isolation material on a glass substrate, etching the first isolation material selectively, and forming several first openings which are arranged in an array in the first isolation material with the first openings being exposed in the surface of the glass substrate; arranging a metal line on the glass substrate with the metal line at least covering the bottom wall and the sidewall of each first opening; filling each first opening with a luminescent material; depositing a second isolation material on the TFT substrate, etching the second isolation material selectively, forming several second openings which are arranged in an array in the second isolation material with the second openings being exposed in the surface of the TFT substrate; arranging the glass substrate and the TFT substrate in an opposite manner, aligning the first openings to the second openings, providing voltag</abstract><oa>free_for_read</oa></addata></record> |
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language | chi ; eng |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | TFT substrate vapor deposition method |
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