Probe card and manufacturing method therefor

The invention discloses a probe card and a manufacturing method therefor. The probe card comprises a circuit board, a grounding piece, a signal conductor, a signal probe front segment, and a grounding conductor. The circuit board is provided with at least one signal contact and at least one groundin...

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Hauptverfasser: CHEN QIUGUI, WEI ZUYOU
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creator CHEN QIUGUI
WEI ZUYOU
description The invention discloses a probe card and a manufacturing method therefor. The probe card comprises a circuit board, a grounding piece, a signal conductor, a signal probe front segment, and a grounding conductor. The circuit board is provided with at least one signal contact and at least one grounding contact on the lower surface. The grounding piece is located on the lower surface of the circuit board, and is electrically connected with the grounding contact. The grounding piece is provided with at least one opening, and the opening enables the signal contact to be exposed. The signal conductor is electrically connected with the signal contact through the opening of the grounding piece. The signal probe front segment is electrically connected to the signal conductor, and is shaped like a cantilever needle. There is an interval between the grounding conductor and the signal conductor, and the grounding conductor is electrically connected to the grounding piece. The grounding conductor can be grounded more conv
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN106885928A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN106885928A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN106885928A3</originalsourceid><addsrcrecordid>eNrjZNAJKMpPSlVITixKUUjMS1HITcwrTUtMLiktysxLV8hNLcnIT1EoyUgtSk3LL-JhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoYGZhYWppZGFo7GxKgBAJESKeo</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Probe card and manufacturing method therefor</title><source>esp@cenet</source><creator>CHEN QIUGUI ; WEI ZUYOU</creator><creatorcontrib>CHEN QIUGUI ; WEI ZUYOU</creatorcontrib><description>The invention discloses a probe card and a manufacturing method therefor. The probe card comprises a circuit board, a grounding piece, a signal conductor, a signal probe front segment, and a grounding conductor. The circuit board is provided with at least one signal contact and at least one grounding contact on the lower surface. The grounding piece is located on the lower surface of the circuit board, and is electrically connected with the grounding contact. The grounding piece is provided with at least one opening, and the opening enables the signal contact to be exposed. The signal conductor is electrically connected with the signal contact through the opening of the grounding piece. The signal probe front segment is electrically connected to the signal conductor, and is shaped like a cantilever needle. There is an interval between the grounding conductor and the signal conductor, and the grounding conductor is electrically connected to the grounding piece. The grounding conductor can be grounded more conv</description><language>chi ; eng</language><subject>MEASURING ; MEASURING ELECTRIC VARIABLES ; MEASURING MAGNETIC VARIABLES ; PHYSICS ; TESTING</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20170623&amp;DB=EPODOC&amp;CC=CN&amp;NR=106885928A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20170623&amp;DB=EPODOC&amp;CC=CN&amp;NR=106885928A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHEN QIUGUI</creatorcontrib><creatorcontrib>WEI ZUYOU</creatorcontrib><title>Probe card and manufacturing method therefor</title><description>The invention discloses a probe card and a manufacturing method therefor. The probe card comprises a circuit board, a grounding piece, a signal conductor, a signal probe front segment, and a grounding conductor. The circuit board is provided with at least one signal contact and at least one grounding contact on the lower surface. The grounding piece is located on the lower surface of the circuit board, and is electrically connected with the grounding contact. The grounding piece is provided with at least one opening, and the opening enables the signal contact to be exposed. The signal conductor is electrically connected with the signal contact through the opening of the grounding piece. The signal probe front segment is electrically connected to the signal conductor, and is shaped like a cantilever needle. There is an interval between the grounding conductor and the signal conductor, and the grounding conductor is electrically connected to the grounding piece. The grounding conductor can be grounded more conv</description><subject>MEASURING</subject><subject>MEASURING ELECTRIC VARIABLES</subject><subject>MEASURING MAGNETIC VARIABLES</subject><subject>PHYSICS</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAJKMpPSlVITixKUUjMS1HITcwrTUtMLiktysxLV8hNLcnIT1EoyUgtSk3LL-JhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoYGZhYWppZGFo7GxKgBAJESKeo</recordid><startdate>20170623</startdate><enddate>20170623</enddate><creator>CHEN QIUGUI</creator><creator>WEI ZUYOU</creator><scope>EVB</scope></search><sort><creationdate>20170623</creationdate><title>Probe card and manufacturing method therefor</title><author>CHEN QIUGUI ; WEI ZUYOU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN106885928A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2017</creationdate><topic>MEASURING</topic><topic>MEASURING ELECTRIC VARIABLES</topic><topic>MEASURING MAGNETIC VARIABLES</topic><topic>PHYSICS</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>CHEN QIUGUI</creatorcontrib><creatorcontrib>WEI ZUYOU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHEN QIUGUI</au><au>WEI ZUYOU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Probe card and manufacturing method therefor</title><date>2017-06-23</date><risdate>2017</risdate><abstract>The invention discloses a probe card and a manufacturing method therefor. The probe card comprises a circuit board, a grounding piece, a signal conductor, a signal probe front segment, and a grounding conductor. The circuit board is provided with at least one signal contact and at least one grounding contact on the lower surface. The grounding piece is located on the lower surface of the circuit board, and is electrically connected with the grounding contact. The grounding piece is provided with at least one opening, and the opening enables the signal contact to be exposed. The signal conductor is electrically connected with the signal contact through the opening of the grounding piece. The signal probe front segment is electrically connected to the signal conductor, and is shaped like a cantilever needle. There is an interval between the grounding conductor and the signal conductor, and the grounding conductor is electrically connected to the grounding piece. The grounding conductor can be grounded more conv</abstract><oa>free_for_read</oa></addata></record>
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language chi ; eng
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subjects MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
TESTING
title Probe card and manufacturing method therefor
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-13T16%3A20%3A24IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=CHEN%20QIUGUI&rft.date=2017-06-23&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN106885928A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true