Printed circuit board processing method and printed circuit board
An embodiment of the invention provides a printed circuit board processing method and a printed circuit board. The method comprises the following steps: processing a printed circuit board, and opening a via hole in a preset area in the printed circuit board; carrying out metallization on the via hol...
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| creator | TAN ZHOUMING ZHU XINGWANG |
| description | An embodiment of the invention provides a printed circuit board processing method and a printed circuit board. The method comprises the following steps: processing a printed circuit board, and opening a via hole in a preset area in the printed circuit board; carrying out metallization on the via hole to form reinforcement column; and forming a bonding pad in the preset area, wherein the bonding pad is connected with the reinforcement column. According to the scheme, the possibility of a failure mode of pad cratering is greatly reduced; and besides, when the printed circuit board is processed through the printed circuit board processing method, batch production of the printed circuit boards can be ensured, and processing cost of the printed circuit board is lower.
本发明实施例提供了种印制电路板加工方法及印制电路板。该方法包括：加工印制电路板，在印制电路板上的预设区域开设过孔；对过孔进行金属化，形成加固柱；在预设区域形成焊盘，其中，焊盘与加固柱连接。容易看出，本方案中，焊垫坑裂这种失效形式出现的可能性会大大降低。另外，当采用本方案中的印制电路板加工方法来加工印制电路板时，印制电路板的批量生产得到了较好地保证，印制电路板的加工成本较低。 |
| format | Patent |
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本发明实施例提供了种印制电路板加工方法及印制电路板。该方法包括：加工印制电路板，在印制电路板上的预设区域开设过孔；对过孔进行金属化，形成加固柱；在预设区域形成焊盘，其中，焊盘与加固柱连接。容易看出，本方案中，焊垫坑裂这种失效形式出现的可能性会大大降低。另外，当采用本方案中的印制电路板加工方法来加工印制电路板时，印制电路板的批量生产得到了较好地保证，印制电路板的加工成本较低。</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170620&DB=EPODOC&CC=CN&NR=106879173A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170620&DB=EPODOC&CC=CN&NR=106879173A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TAN ZHOUMING</creatorcontrib><creatorcontrib>ZHU XINGWANG</creatorcontrib><title>Printed circuit board processing method and printed circuit board</title><description>An embodiment of the invention provides a printed circuit board processing method and a printed circuit board. The method comprises the following steps: processing a printed circuit board, and opening a via hole in a preset area in the printed circuit board; carrying out metallization on the via hole to form reinforcement column; and forming a bonding pad in the preset area, wherein the bonding pad is connected with the reinforcement column. According to the scheme, the possibility of a failure mode of pad cratering is greatly reduced; and besides, when the printed circuit board is processed through the printed circuit board processing method, batch production of the printed circuit boards can be ensured, and processing cost of the printed circuit board is lower.
本发明实施例提供了种印制电路板加工方法及印制电路板。该方法包括：加工印制电路板，在印制电路板上的预设区域开设过孔；对过孔进行金属化，形成加固柱；在预设区域形成焊盘，其中，焊盘与加固柱连接。容易看出，本方案中，焊垫坑裂这种失效形式出现的可能性会大大降低。另外，当采用本方案中的印制电路板加工方法来加工印制电路板时，印制电路板的批量生产得到了较好地保证，印制电路板的加工成本较低。</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAMKMrMK0lNUUjOLEouzSxRSMpPLEpRKCjKT04tLs7MS1fITS3JyE9RSMwDiWJRy8PAmpaYU5zKC6W5GRTdXEOcPXRTC_LjU4sLEpNT81JL4p39DA3MLMwtDc2NHY2JUQMAIQsx7w</recordid><startdate>20170620</startdate><enddate>20170620</enddate><creator>TAN ZHOUMING</creator><creator>ZHU XINGWANG</creator><scope>EVB</scope></search><sort><creationdate>20170620</creationdate><title>Printed circuit board processing method and printed circuit board</title><author>TAN ZHOUMING ; ZHU XINGWANG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN106879173A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2017</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>TAN ZHOUMING</creatorcontrib><creatorcontrib>ZHU XINGWANG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TAN ZHOUMING</au><au>ZHU XINGWANG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Printed circuit board processing method and printed circuit board</title><date>2017-06-20</date><risdate>2017</risdate><abstract>An embodiment of the invention provides a printed circuit board processing method and a printed circuit board. The method comprises the following steps: processing a printed circuit board, and opening a via hole in a preset area in the printed circuit board; carrying out metallization on the via hole to form reinforcement column; and forming a bonding pad in the preset area, wherein the bonding pad is connected with the reinforcement column. According to the scheme, the possibility of a failure mode of pad cratering is greatly reduced; and besides, when the printed circuit board is processed through the printed circuit board processing method, batch production of the printed circuit boards can be ensured, and processing cost of the printed circuit board is lower.
本发明实施例提供了种印制电路板加工方法及印制电路板。该方法包括：加工印制电路板，在印制电路板上的预设区域开设过孔；对过孔进行金属化，形成加固柱；在预设区域形成焊盘，其中，焊盘与加固柱连接。容易看出，本方案中，焊垫坑裂这种失效形式出现的可能性会大大降低。另外，当采用本方案中的印制电路板加工方法来加工印制电路板时，印制电路板的批量生产得到了较好地保证，印制电路板的加工成本较低。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Printed circuit board processing method and printed circuit board |
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