Preparation system of glass micro-channel
The invention discloses a preparation system of a glass micro-channel. The preparation system comprises a first moving platform and a cutting head lens set and further comprises an infrared laser and a base plate which is fixed to the first moving platform. The first moving platform is used for movi...
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| creator | HU WEI CAO ZHOUQUAN LIU SHUAI WENG QING XIE XIAOZHU WEI XIN |
| description | The invention discloses a preparation system of a glass micro-channel. The preparation system comprises a first moving platform and a cutting head lens set and further comprises an infrared laser and a base plate which is fixed to the first moving platform. The first moving platform is used for moving on an x/y plane according to control instructions sent by a computer. The infrared laser is used for emitting infrared laser light. The cutting head laser set is used for receiving the infrared laser light and making the infrared laser light be focused on the upper surface of the base plate, so that micro-channel back engraving is performed on a glass substrate put on the upper surface of the base plate and then a glass micro-channel substrate is obtained. By means of the preparation system of the glass micro-channel, the effect that the glass micro-channel is prepared through infrared laser light is achieved, and the whole cost is reduced.
本发明公开了种玻璃微流道的制备系统，包括第移动平台和切割头透镜组，第移动平台，用于依据计算机发出的控制指令在x/y平面上移动；还包括红外激光器以 |
| format | Patent |
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本发明公开了种玻璃微流道的制备系统，包括第移动平台和切割头透镜组，第移动平台，用于依据计算机发出的控制指令在x/y平面上移动；还包括红外激光器以</description><language>chi ; eng</language><subject>CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170524&DB=EPODOC&CC=CN&NR=106695119A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170524&DB=EPODOC&CC=CN&NR=106695119A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HU WEI</creatorcontrib><creatorcontrib>CAO ZHOUQUAN</creatorcontrib><creatorcontrib>LIU SHUAI</creatorcontrib><creatorcontrib>WENG QING</creatorcontrib><creatorcontrib>XIE XIAOZHU</creatorcontrib><creatorcontrib>WEI XIN</creatorcontrib><title>Preparation system of glass micro-channel</title><description>The invention discloses a preparation system of a glass micro-channel. The preparation system comprises a first moving platform and a cutting head lens set and further comprises an infrared laser and a base plate which is fixed to the first moving platform. The first moving platform is used for moving on an x/y plane according to control instructions sent by a computer. The infrared laser is used for emitting infrared laser light. The cutting head laser set is used for receiving the infrared laser light and making the infrared laser light be focused on the upper surface of the base plate, so that micro-channel back engraving is performed on a glass substrate put on the upper surface of the base plate and then a glass micro-channel substrate is obtained. By means of the preparation system of the glass micro-channel, the effect that the glass micro-channel is prepared through infrared laser light is achieved, and the whole cost is reduced.
本发明公开了种玻璃微流道的制备系统，包括第移动平台和切割头透镜组，第移动平台，用于依据计算机发出的控制指令在x/y平面上移动；还包括红外激光器以</description><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAMKEotSCxKLMnMz1MoriwuSc1VyE9TSM9JLC5WyM1MLsrXTc5IzMtLzeFhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoYGZmaWpoaGlo7GxKgBABKeKNU</recordid><startdate>20170524</startdate><enddate>20170524</enddate><creator>HU WEI</creator><creator>CAO ZHOUQUAN</creator><creator>LIU SHUAI</creator><creator>WENG QING</creator><creator>XIE XIAOZHU</creator><creator>WEI XIN</creator><scope>EVB</scope></search><sort><creationdate>20170524</creationdate><title>Preparation system of glass micro-channel</title><author>HU WEI ; CAO ZHOUQUAN ; LIU SHUAI ; WENG QING ; XIE XIAOZHU ; WEI XIN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN106695119A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2017</creationdate><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>HU WEI</creatorcontrib><creatorcontrib>CAO ZHOUQUAN</creatorcontrib><creatorcontrib>LIU SHUAI</creatorcontrib><creatorcontrib>WENG QING</creatorcontrib><creatorcontrib>XIE XIAOZHU</creatorcontrib><creatorcontrib>WEI XIN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HU WEI</au><au>CAO ZHOUQUAN</au><au>LIU SHUAI</au><au>WENG QING</au><au>XIE XIAOZHU</au><au>WEI XIN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Preparation system of glass micro-channel</title><date>2017-05-24</date><risdate>2017</risdate><abstract>The invention discloses a preparation system of a glass micro-channel. The preparation system comprises a first moving platform and a cutting head lens set and further comprises an infrared laser and a base plate which is fixed to the first moving platform. The first moving platform is used for moving on an x/y plane according to control instructions sent by a computer. The infrared laser is used for emitting infrared laser light. The cutting head laser set is used for receiving the infrared laser light and making the infrared laser light be focused on the upper surface of the base plate, so that micro-channel back engraving is performed on a glass substrate put on the upper surface of the base plate and then a glass micro-channel substrate is obtained. By means of the preparation system of the glass micro-channel, the effect that the glass micro-channel is prepared through infrared laser light is achieved, and the whole cost is reduced.
本发明公开了种玻璃微流道的制备系统，包括第移动平台和切割头透镜组，第移动平台，用于依据计算机发出的控制指令在x/y平面上移动；还包括红外激光器以</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | Preparation system of glass micro-channel |
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