Palladium plating solution and palladium coating obtained using same
The present invention addresses the problem of providing a palladium plating solution in which occurrence of defective parts such as pin holes on a palladium coating is reduced, and in which heat resistance performance equivalent to that obtained conventionally can be obtained even when a gold plati...
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| creator | KIYOHARA YOSHIZO NAKAGAWA YUSUKE SHIBATA KAZUYA OHSUKA RYUTA OKUBO YUYA |
| description | The present invention addresses the problem of providing a palladium plating solution in which occurrence of defective parts such as pin holes on a palladium coating is reduced, and in which heat resistance performance equivalent to that obtained conventionally can be obtained even when a gold plating coating formed on the palladium coating is made thinner. The problem was overcome by: a palladium plating solution containing a soluble palladium salt as a palladium source, and a specific pyridinium compound in which an alkyl group is bonded to a nitrogen atom at the 1-position and one to five of the 2- to 6-positions are substituted with one or more specific substituents selected from the group consisting of an alkyl group, an aryl group, a carboxy group, an alkoxycarbonyl group, a sulfo group, an alkoxy sulfonyl group, an amino group, an alkylamino group, a dialkylamino group, and a cyano group; and a palladium coating obtained by performing palladium plating on a nickel, nickel alloy, copper, or copper alloy |
| format | Patent |
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The problem was overcome by: a palladium plating solution containing a soluble palladium salt as a palladium source, and a specific pyridinium compound in which an alkyl group is bonded to a nitrogen atom at the 1-position and one to five of the 2- to 6-positions are substituted with one or more specific substituents selected from the group consisting of an alkyl group, an aryl group, a carboxy group, an alkoxycarbonyl group, a sulfo group, an alkoxy sulfonyl group, an amino group, an alkylamino group, a dialkylamino group, and a cyano group; and a palladium coating obtained by performing palladium plating on a nickel, nickel alloy, copper, or copper alloy</description><language>chi ; eng</language><subject>APPARATUS THEREFOR ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170510&DB=EPODOC&CC=CN&NR=106661735A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170510&DB=EPODOC&CC=CN&NR=106661735A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KIYOHARA YOSHIZO</creatorcontrib><creatorcontrib>NAKAGAWA YUSUKE</creatorcontrib><creatorcontrib>SHIBATA KAZUYA</creatorcontrib><creatorcontrib>OHSUKA RYUTA</creatorcontrib><creatorcontrib>OKUBO YUYA</creatorcontrib><title>Palladium plating solution and palladium coating obtained using same</title><description>The present invention addresses the problem of providing a palladium plating solution in which occurrence of defective parts such as pin holes on a palladium coating is reduced, and in which heat resistance performance equivalent to that obtained conventionally can be obtained even when a gold plating coating formed on the palladium coating is made thinner. 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The problem was overcome by: a palladium plating solution containing a soluble palladium salt as a palladium source, and a specific pyridinium compound in which an alkyl group is bonded to a nitrogen atom at the 1-position and one to five of the 2- to 6-positions are substituted with one or more specific substituents selected from the group consisting of an alkyl group, an aryl group, a carboxy group, an alkoxycarbonyl group, a sulfo group, an alkoxy sulfonyl group, an amino group, an alkylamino group, a dialkylamino group, and a cyano group; and a palladium coating obtained by performing palladium plating on a nickel, nickel alloy, copper, or copper alloy</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | APPARATUS THEREFOR CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | Palladium plating solution and palladium coating obtained using same |
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