Water arraying method

The invention provides a wafer arraying method. The arraying method comprises the following steps: first, providing at least one wafer and an arraying device, wherein the arraying device includes an attracting component and a limiting component; then, using the attracting component to attract a surface of the wafer, and driving the attracting component to move the wafer to the limiting component; and finally, under the condition that the attracting component attracts and holds the wafer, clamping the wafer with the limiting component to locate the position of the wafer. 本发明提供了种晶圆的整列方法。该整列方法包括下列步骤：首先，提供至少晶圆与整列装置，其中整列装置包括吸引构件与限位构件；接着，以吸引构件吸持晶圆的表面，并驱动吸引构件将晶圆移动至限位构件；以及于吸引构件吸持晶圆的状况下，以限位构件夹置晶圆以定位晶圆的位置。