Height gauge

The invention relates to the field of a mechanical mapping apparatus and particularly relates to a height gauge. The height gauge comprises a foundation and a main gauge fixedly arranged on the foundation, wherein the main gauge is movably equipped with a vernier gauge in a guiding mode, the height...

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Hauptverfasser: LI FUMING, JI SHUAI, FENG SHUO, XIAO XINCHEN, SUN QING, ZHANG ZIMING, WANG YAQI
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Sprache:chi ; eng
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creator LI FUMING
JI SHUAI
FENG SHUO
XIAO XINCHEN
SUN QING
ZHANG ZIMING
WANG YAQI
description The invention relates to the field of a mechanical mapping apparatus and particularly relates to a height gauge. The height gauge comprises a foundation and a main gauge fixedly arranged on the foundation, wherein the main gauge is movably equipped with a vernier gauge in a guiding mode, the height gauge further comprises a secondary gauge which is movably assembled on the main gauge in a guiding mode, guiding moving directions of the secondary gauge and the main gauge are consistent, the secondary gauge is provided with a secondary gauge scale, the vernier gauge is provided with a secondary gauge vernier scale corresponding to the secondary gauge scale, and the height gauge further comprises a locking members used for locking and fixing the secondary gauge and the main gauge. The height gauge is advantaged in that the secondary gauge is directly assembled on the main gauge, the secondary gauge and the main gauge are directly matched, so control on assembling precision in a manufacturing process can be facili
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN106546151A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN106546151A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN106546151A3</originalsourceid><addsrcrecordid>eNrjZODxSM1MzyhRSE8sTU_lYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxzn6GBmamJmaGpoaOxsSoAQD0xh1v</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Height gauge</title><source>esp@cenet</source><creator>LI FUMING ; JI SHUAI ; FENG SHUO ; XIAO XINCHEN ; SUN QING ; ZHANG ZIMING ; WANG YAQI</creator><creatorcontrib>LI FUMING ; JI SHUAI ; FENG SHUO ; XIAO XINCHEN ; SUN QING ; ZHANG ZIMING ; WANG YAQI</creatorcontrib><description>The invention relates to the field of a mechanical mapping apparatus and particularly relates to a height gauge. The height gauge comprises a foundation and a main gauge fixedly arranged on the foundation, wherein the main gauge is movably equipped with a vernier gauge in a guiding mode, the height gauge further comprises a secondary gauge which is movably assembled on the main gauge in a guiding mode, guiding moving directions of the secondary gauge and the main gauge are consistent, the secondary gauge is provided with a secondary gauge scale, the vernier gauge is provided with a secondary gauge vernier scale corresponding to the secondary gauge scale, and the height gauge further comprises a locking members used for locking and fixing the secondary gauge and the main gauge. The height gauge is advantaged in that the secondary gauge is directly assembled on the main gauge, the secondary gauge and the main gauge are directly matched, so control on assembling precision in a manufacturing process can be facili</description><language>chi ; eng</language><subject>MEASURING ; MEASURING ANGLES ; MEASURING AREAS ; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS ; MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS ; PHYSICS ; TESTING</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20170329&amp;DB=EPODOC&amp;CC=CN&amp;NR=106546151A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20170329&amp;DB=EPODOC&amp;CC=CN&amp;NR=106546151A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LI FUMING</creatorcontrib><creatorcontrib>JI SHUAI</creatorcontrib><creatorcontrib>FENG SHUO</creatorcontrib><creatorcontrib>XIAO XINCHEN</creatorcontrib><creatorcontrib>SUN QING</creatorcontrib><creatorcontrib>ZHANG ZIMING</creatorcontrib><creatorcontrib>WANG YAQI</creatorcontrib><title>Height gauge</title><description>The invention relates to the field of a mechanical mapping apparatus and particularly relates to a height gauge. The height gauge comprises a foundation and a main gauge fixedly arranged on the foundation, wherein the main gauge is movably equipped with a vernier gauge in a guiding mode, the height gauge further comprises a secondary gauge which is movably assembled on the main gauge in a guiding mode, guiding moving directions of the secondary gauge and the main gauge are consistent, the secondary gauge is provided with a secondary gauge scale, the vernier gauge is provided with a secondary gauge vernier scale corresponding to the secondary gauge scale, and the height gauge further comprises a locking members used for locking and fixing the secondary gauge and the main gauge. The height gauge is advantaged in that the secondary gauge is directly assembled on the main gauge, the secondary gauge and the main gauge are directly matched, so control on assembling precision in a manufacturing process can be facili</description><subject>MEASURING</subject><subject>MEASURING ANGLES</subject><subject>MEASURING AREAS</subject><subject>MEASURING IRREGULARITIES OF SURFACES OR CONTOURS</subject><subject>MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS</subject><subject>PHYSICS</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZODxSM1MzyhRSE8sTU_lYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxzn6GBmamJmaGpoaOxsSoAQD0xh1v</recordid><startdate>20170329</startdate><enddate>20170329</enddate><creator>LI FUMING</creator><creator>JI SHUAI</creator><creator>FENG SHUO</creator><creator>XIAO XINCHEN</creator><creator>SUN QING</creator><creator>ZHANG ZIMING</creator><creator>WANG YAQI</creator><scope>EVB</scope></search><sort><creationdate>20170329</creationdate><title>Height gauge</title><author>LI FUMING ; JI SHUAI ; FENG SHUO ; XIAO XINCHEN ; SUN QING ; ZHANG ZIMING ; WANG YAQI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN106546151A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2017</creationdate><topic>MEASURING</topic><topic>MEASURING ANGLES</topic><topic>MEASURING AREAS</topic><topic>MEASURING IRREGULARITIES OF SURFACES OR CONTOURS</topic><topic>MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS</topic><topic>PHYSICS</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>LI FUMING</creatorcontrib><creatorcontrib>JI SHUAI</creatorcontrib><creatorcontrib>FENG SHUO</creatorcontrib><creatorcontrib>XIAO XINCHEN</creatorcontrib><creatorcontrib>SUN QING</creatorcontrib><creatorcontrib>ZHANG ZIMING</creatorcontrib><creatorcontrib>WANG YAQI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LI FUMING</au><au>JI SHUAI</au><au>FENG SHUO</au><au>XIAO XINCHEN</au><au>SUN QING</au><au>ZHANG ZIMING</au><au>WANG YAQI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Height gauge</title><date>2017-03-29</date><risdate>2017</risdate><abstract>The invention relates to the field of a mechanical mapping apparatus and particularly relates to a height gauge. The height gauge comprises a foundation and a main gauge fixedly arranged on the foundation, wherein the main gauge is movably equipped with a vernier gauge in a guiding mode, the height gauge further comprises a secondary gauge which is movably assembled on the main gauge in a guiding mode, guiding moving directions of the secondary gauge and the main gauge are consistent, the secondary gauge is provided with a secondary gauge scale, the vernier gauge is provided with a secondary gauge vernier scale corresponding to the secondary gauge scale, and the height gauge further comprises a locking members used for locking and fixing the secondary gauge and the main gauge. The height gauge is advantaged in that the secondary gauge is directly assembled on the main gauge, the secondary gauge and the main gauge are directly matched, so control on assembling precision in a manufacturing process can be facili</abstract><oa>free_for_read</oa></addata></record>
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language chi ; eng
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subjects MEASURING
MEASURING ANGLES
MEASURING AREAS
MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS
PHYSICS
TESTING
title Height gauge
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-28T16%3A51%3A42IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LI%20FUMING&rft.date=2017-03-29&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN106546151A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true