Composition for blackening copper-based or silver-based metals

The present invention addresses the problem of providing a new composition for blackening that, without compromising the smoothness of copper-based or silver-based metals, allows for sufficient blackening of copper circuits of printed wiring boards, circuits formed by silver paste, and products cont...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SAKAI HIROAKI, KITA AZUSA, KANG JOONHAENG
Format: Patent
Sprache:chi ; eng
Schlagworte:
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