Microwave circuit composite substrate with built-in magnetic disk
The invention discloses a microwave circuit composite substrate with a magnetic disk. The microwave circuit composite substrate comprises a composite plate and the magnetic disk (1) embedded in the composite plate. The composite plate comprises a metal plate (2), a dielectric layer (3) and a PP laye...
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| creator | YANG JIFANG DUAN SHUBIN GUO YONGQIANG MAN JILING |
| description | The invention discloses a microwave circuit composite substrate with a magnetic disk. The microwave circuit composite substrate comprises a composite plate and the magnetic disk (1) embedded in the composite plate. The composite plate comprises a metal plate (2), a dielectric layer (3) and a PP layer (5), the PP layer (5) is arranged between the metal plate (2) and the dielectric layer (3), the upper and lower surfaces of the dielectric layer (3) are provided with a metal layer (4), the metal plate (2) is compounded on the upper surface of the PP layer (5) through an adhesive layer (6), and the PP layer (5) is bonded to the upper portion of the dielectric layer (3) via the adhesive layer (6). The microwave circuit composite substrate has the advantages that the substrate volume is greatly reduced, the nonreciprocal transmission device and the reciprocal transmission device can be integrated in the microwave circuit composite substrate to improve the electrical performance and reliability, and produce differen |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN106455298A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN106455298A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN106455298A3</originalsourceid><addsrcrecordid>eNrjZHD0zUwuyi9PLEtVSM4sSi7NLFFIzs8tyC_OLElVKC5NKi4pSgSyyjNLMhSSSjNzSnQz8xRyE9PzUksykxVSMouzeRhY0xJzilN5oTQ3g6Kba4izh25qQX58anFBYnIqUHG8s5-hgZmJqamRpYWjMTFqAEy4Mjs</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Microwave circuit composite substrate with built-in magnetic disk</title><source>esp@cenet</source><creator>YANG JIFANG ; DUAN SHUBIN ; GUO YONGQIANG ; MAN JILING</creator><creatorcontrib>YANG JIFANG ; DUAN SHUBIN ; GUO YONGQIANG ; MAN JILING</creatorcontrib><description>The invention discloses a microwave circuit composite substrate with a magnetic disk. The microwave circuit composite substrate comprises a composite plate and the magnetic disk (1) embedded in the composite plate. The composite plate comprises a metal plate (2), a dielectric layer (3) and a PP layer (5), the PP layer (5) is arranged between the metal plate (2) and the dielectric layer (3), the upper and lower surfaces of the dielectric layer (3) are provided with a metal layer (4), the metal plate (2) is compounded on the upper surface of the PP layer (5) through an adhesive layer (6), and the PP layer (5) is bonded to the upper portion of the dielectric layer (3) via the adhesive layer (6). The microwave circuit composite substrate has the advantages that the substrate volume is greatly reduced, the nonreciprocal transmission device and the reciprocal transmission device can be integrated in the microwave circuit composite substrate to improve the electrical performance and reliability, and produce differen</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170222&DB=EPODOC&CC=CN&NR=106455298A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170222&DB=EPODOC&CC=CN&NR=106455298A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YANG JIFANG</creatorcontrib><creatorcontrib>DUAN SHUBIN</creatorcontrib><creatorcontrib>GUO YONGQIANG</creatorcontrib><creatorcontrib>MAN JILING</creatorcontrib><title>Microwave circuit composite substrate with built-in magnetic disk</title><description>The invention discloses a microwave circuit composite substrate with a magnetic disk. The microwave circuit composite substrate comprises a composite plate and the magnetic disk (1) embedded in the composite plate. The composite plate comprises a metal plate (2), a dielectric layer (3) and a PP layer (5), the PP layer (5) is arranged between the metal plate (2) and the dielectric layer (3), the upper and lower surfaces of the dielectric layer (3) are provided with a metal layer (4), the metal plate (2) is compounded on the upper surface of the PP layer (5) through an adhesive layer (6), and the PP layer (5) is bonded to the upper portion of the dielectric layer (3) via the adhesive layer (6). The microwave circuit composite substrate has the advantages that the substrate volume is greatly reduced, the nonreciprocal transmission device and the reciprocal transmission device can be integrated in the microwave circuit composite substrate to improve the electrical performance and reliability, and produce differen</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHD0zUwuyi9PLEtVSM4sSi7NLFFIzs8tyC_OLElVKC5NKi4pSgSyyjNLMhSSSjNzSnQz8xRyE9PzUksykxVSMouzeRhY0xJzilN5oTQ3g6Kba4izh25qQX58anFBYnIqUHG8s5-hgZmJqamRpYWjMTFqAEy4Mjs</recordid><startdate>20170222</startdate><enddate>20170222</enddate><creator>YANG JIFANG</creator><creator>DUAN SHUBIN</creator><creator>GUO YONGQIANG</creator><creator>MAN JILING</creator><scope>EVB</scope></search><sort><creationdate>20170222</creationdate><title>Microwave circuit composite substrate with built-in magnetic disk</title><author>YANG JIFANG ; DUAN SHUBIN ; GUO YONGQIANG ; MAN JILING</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN106455298A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2017</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>YANG JIFANG</creatorcontrib><creatorcontrib>DUAN SHUBIN</creatorcontrib><creatorcontrib>GUO YONGQIANG</creatorcontrib><creatorcontrib>MAN JILING</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YANG JIFANG</au><au>DUAN SHUBIN</au><au>GUO YONGQIANG</au><au>MAN JILING</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Microwave circuit composite substrate with built-in magnetic disk</title><date>2017-02-22</date><risdate>2017</risdate><abstract>The invention discloses a microwave circuit composite substrate with a magnetic disk. The microwave circuit composite substrate comprises a composite plate and the magnetic disk (1) embedded in the composite plate. The composite plate comprises a metal plate (2), a dielectric layer (3) and a PP layer (5), the PP layer (5) is arranged between the metal plate (2) and the dielectric layer (3), the upper and lower surfaces of the dielectric layer (3) are provided with a metal layer (4), the metal plate (2) is compounded on the upper surface of the PP layer (5) through an adhesive layer (6), and the PP layer (5) is bonded to the upper portion of the dielectric layer (3) via the adhesive layer (6). The microwave circuit composite substrate has the advantages that the substrate volume is greatly reduced, the nonreciprocal transmission device and the reciprocal transmission device can be integrated in the microwave circuit composite substrate to improve the electrical performance and reliability, and produce differen</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Microwave circuit composite substrate with built-in magnetic disk |
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